Sr. Package Layout Engineer, Annapurna Labs AI Silicon Packaging

Annapurna Labs (our organization within AWS) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time agoeven yesterday. Our custom chips accelerators and software stacks enable us to take on technical challenges that have never been seen before and deliver results that help our customers change the world.

We are seeking a Sr. Package Layout Engineer to lead the end-to-end physical design of advanced IC packages for next-generation machine learning and data center ASICs.

In this role you will own the package layout from initial floor planning through tape out and manufacturing release. Youll drive the physical implementation of complex multi-die and advanced packaging architectures working closely with silicon SI/PI thermal and manufacturing teams to deliver production-ready designs that meet dynamic performance density and reliability targets.

Key job responsibilities
- Lead the full package layout cycle from die floor planning bump/pad assignment and RDL routing through substrate design verification and tape out release.
- Drive physical design of advanced packaging architectures including 2.5D interposer 3D-IC fan-out wafer-level packaging and silicon bridge technologies (e.g. CoWoS EMIB or similar).
- Define and optimize package floorplans considering die placement bump maps power/ground distribution high-speed signal escape routing and decoupling capacitor placement.
- Perform detailed RDL and substrate routing for high-density interconnects including microbumps C4 bumps TSVs microvias and PTH vias across multi-layer organic substrates and silicon interposers.
- Participate in die-level RDL routing and bump planning in coordination with ASIC physical design teams ensuring the die-package interface is co-optimized for power delivery and signal routing from the earliest design stages.
- Drive cross-level layout co-optimization across die RDL interposer/substrate and PCB levels to achieve the best overall power delivery network and high-speed signaling performance minimizing impedance discontinuities and routing bottlenecks at each interface boundary.
- Develop and maintain package stack-up definitions in collaboration with SI/PI and materials engineering teams ensuring impedance targets layer utilization and manufacturing constraints are met.
- Create and enforce package design rules and guidelines working with OSAT partners and foundries to ensure DFM compliance and high yield.
- Run and review physical verification checks (DRC connectivity shorts/opens) and drive design closure with zero escapes.
- Manage package design schedules milestones and deliverables coordinating across multiple concurrent projects and tape out cycles.
- Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout impedance-controlled routing power plane optimization and critical net shielding.
- Interface with OSAT vendors and foundry partners on substrate and interposer manufacturing feasibility design rule negotiations and process capability alignment.
- Identify packaging technology risks early and propose design or process mitigations to ensure reliability and manufacturability.
- Mentor junior layout engineers and contribute to the development of team best practices automation flows and design reuse strategies.

About the team
Our team is dedicated to supporting new members. We have a broad mix of experience levels and tenures and were building an environment that celebrates knowledge-sharing and mentorship. Our senior members enjoy one-on-one mentoring and thorough but kind code reviews. We care about your career growth and strive to assign projects that help our team members develop your engineering expertise so you feel empowered to take on more complex tasks in the future.

Diverse Experiences
AWS values diverse experiences. Even if you do not meet all of the qualifications and skills listed in the job description we encourage candidates to apply. If your career is just starting hasnt followed a traditional path or includes alternative experiences dont let it stop you from applying.

About AWS
Amazon Web Services (AWS) is the worlds most comprehensive and broadly adopted cloud platform. We pioneered cloud computing and never stopped innovating thats why customers from the most successful startups to Global 500 companies trust our robust suite of products and services to power their businesses.

Inclusive Team Culture
Here at AWS its in our nature to learn and be curious. Our employee-led affinity groups foster a culture of inclusion that empower us to be proud of our differences. Ongoing events and learning experiences including our Conversations on Race and Ethnicity (CORE) and AmazeCon (gender diversity) conferences inspire us to never stop embracing our uniqueness.

Work/Life Balance
We value work-life harmony. Achieving success at work should never come at the expense of sacrifices at home which is why we strive for flexibility as part of our working culture. When we feel supported in the workplace and at home theres nothing we cant achieve in the cloud.

Mentorship & Career Growth
Were continuously raising our performance bar as we strive to become Earths Best Employer. Thats why youll find endless knowledge-sharing mentorship and other career-advancing resources here to help you develop into a better-rounded professional.

- Bachelors degree in electrical engineering material engineering mechanical engineering or related fields
- 10 years of experience in IC package layout and physical design
- Proven track record of leading package designs from concept through tape out for complex multi-layer organic substrates or silicon interposers
- Hands-on expertise with package layout tools such as Cadence APD/SiP Synopsys IC Packaging Mentor Xpedition or equivalent
- Deep understanding of advanced packaging technologies: 2.5D/3D-IC fan-out WLP RDL TSV microbump and silicon bridge interconnects
- Strong knowledge of package design rules DFM constraints and physical verification methodologies (DRC connectivity checks)
- Experience with bump map and ball map definition escape routing strategies and power/ground plane design for high pin-count packages
- Familiarity with substrate and interposer manufacturing processes material properties and their impact on design decisions

- Masters degree or equivalent in mechanical engineering electrical engineering material science physics or equivalent
- 7 years in IC package layout and physical design
- Experience with chiplet-based or heterogeneous integration packaging architectures
- Familiarity with package-level SI/PI concepts (impedance control PDN layout crosstalk-aware routing) sufficient to collaborate effectively with SI/PI engineers
- Experience developing automation scripts (Python TCL Skill Ravel) for layout tasks design rule checks or data exchange workflows
- Hands-on experience working directly with OSAT partners on NPI (new product introduction) builds and yield improvement
- Knowledge of package-level thermal design considerations and their impact on layout decisions (hot spot management thermal via placement).
- Experience with high-bandwidth memory (HBM) integration in advanced packaging contexts.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status disability or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.

The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience qualifications and location. Amazon also offers comprehensive benefits including health insurance (medical dental vision prescription Basic Life & AD&D insurance and option for Supplemental life plans EAP Mental Health Support Medical Advice Line Flexible Spending Accounts Adoption and Surrogacy Reimbursement coverage) 401(k) matching paid time off and parental leave. Learn more about our benefits at CA Cupertino - 183000.00 - 247600.00 USD annually
USA TX Austin - 159200.00 - 215300.00 USD annually