Power Electronics Process Analysis Engineer
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Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Department:
Job Summary
This role is focused on manufacturing process performance defect detection and root cause analysisnot product design or electrical testing. Responsible for analyzing improving and validating soldering and welding processes in power electronics manufacturing through hands-on failure analysis cross-sectioning techniques and advanced inspection systems (AOI/AXI).
Responsibilities
Key Responsibilities
- Perform hands-on cross-sectioning and solder/welding joint analysis to evaluate solder quality identify defects (voids cracks insufficient wetting etc.) and support root cause investigations.
- Operate and interpret results from AOI (Automated Optical Inspection) and AXI (X-ray Inspection) systems to detect and classify soldering defects in power electronics assemblies.
- Analyze welding & soldering processes (selective soldering reflow or similar) ensuring robust and repeatable manufacturing performance.
- Perform mechanical validation of solder joints including pull/shear or tensile-type evaluations when applicable.
- Lead failure analysis activities using laboratory equipment (cutting mounting polishing microscopy) to determine defect origin and drive corrective actions.
- Correlate inspection findings (AOI/AXI) with physical analysis (cross-sections intermetallic evaluation) to validate defect mechanisms and process gaps.
- Support continuous improvement initiatives focused on defect reduction yield improvement and process stability.
- Work closely with manufacturing quality and supplier teams to ensure process alignment and defect containment.
- Define and standardize inspection criteria and acceptance thresholds for solder joints in power electronics products.
Qualifications
Please read the requirements and qualifications for this position carefully before applying.
- Education: Bachelors degree in Engineering (Mechanical Electrical Manufacturing Mechatronics or related field).
Required Qualifications
- Strong hands-on experience with cross-sectioning and solder joint analysis including intermetallic evaluation and void detection.
- Proven experience using AOI and AXI inspection systems (defect detection programming interpretation of results).
- Experience in failure analysis and root cause investigation in a manufacturing environment.
- Hands-on experience with laboratory equipment for sample preparation including:
- Precision cutting tools
- Diamond saws
- Waterjet cutting
- Wire EDM cutting
- Mounting and polishing equipment
- Experience performing or supporting mechanical testing of solder joints (pull shear or tensile methods).
- Ability to define cutting and preparation methodologies for new product introductions (NPI). Experience working in production environments with a focus on quality and process improvement.
Preferred Qualifications
- Experience in high-reliability or automotive power electronics manufacturing.
- Knowledge of IPC standards (e.g. IPC-A-610 IPC-7095).
- Experience correlating process parameters with defect generation.
- Exposure to continuous improvement methodologies (Six Sigma etc.).
Inspection & Process Expertise:
Demonstrated experience validating and analyzing soldering and welding processes using laboratory and inline inspection systems (AOI AXI CT inspection) including:
- Vacuum Soldering
- CT inspection and defect analysis
- Solder wetting evaluation
- Void detection and analysis
- Bond line thickness control
- Excess solder / solder bleed-out identification
- Laser Welding
- Destructive validation methods
- Weld depth penetration analysis
- Weld length verification
- Weld inspection area definition and validation
- Selective Soldering
- Pin protrusion evaluation
- Percentage of land area covered with wetted solder on secondary side (solder source side)
- Wetting on solder source side of lead and barrel
- Excess solder defects (solder balls)
- Bridging defects
- Solder webbing / splashes
- Solder fracture / blow holes
- Solder connection wetting angle evaluation
- Non-wetting conditions
- Solder volume control
- Vertical fill validation
- Language Skills: Advanced proficiency in English (written and verbal) to support global reporting technical documentation and cross-functional collaboration.
Required Experience:
IC
Key Skills
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