關於我們MTB HBM 團隊

隨著 AIHPC高效能運算與資料中心 的快速成長
HBMHigh Bandwidth Memory高頻寬記憶體 已成為下一世代最關鍵的記憶體技術之一

MTBMicron Taichung BackendHBM 團隊 正處於快速擴編階段
長期招募對 半導體設備先進封裝與量產技術 有熱情的人才
誠摯邀請你加入我們一起參與 全球最前線的 HBM 量產與技術發展

HBM 相關職缺總覽

歡迎 具半導體相關經驗 的人才
應屆畢業生新鮮人 亦可投遞依職缺別

職位要求與技能條件

學歷背景

• 電機電子機械材料機電整合或相關理工科系
• 產線作業員助理工程師高中專科大學以上
• 輪班工程師學士以上尤佳

工作型態

• 願意配合 輪班制作四休三作三休四 與假日值勤
• 可接受 無塵室工作環境

個人特質

• 具良好溝通能力與團隊合作精神
• 主動積極抗壓性高具備問題解決能力
• 對半導體設備與先進製造技術有高度學習意願

關於 HBM 技術你將接觸的未來關鍵領域

HBM 是專為 AIGPUHPC 打造的高效能記憶體
透過 3D 堆疊與先進封裝技術TSV2.5D3D 封裝
大幅提升資料傳輸頻寬與能源效率

加入 MTB HBM 團隊你將

• 直接參與 HBM 量產線設備與先進封裝技術
• 接觸全球最先進的 AI 記憶體應用
• 在快速成長的技術領域中累積關鍵製造與設備經驗
• 擁有未來轉任 設備專家Tool Owner專案常日工程角色 的發展機會

為什麼加入 MTB HBM

• 參與 全球最關鍵的 AIHBM 技術量產
• 完整設備訓練與技術累積
• 穩定且具發展性的半導體職涯路徑
• 對新鮮人與轉職者都友善的成長環境

About Us MTB HBM Team

With the rapid growth of AI High-Performance Computing (HPC) and data centers
HBM (High Bandwidth Memory) has become one of the most critical next-generation memory technologies.

The MTB (Micron Taichung Backend) HBM Team is expanding rapidly and continuously hiring talents who are passionate about semiconductor equipment advanced packaging and high-volume manufacturing.
We sincerely invite you to join us and be part of the worlds leading HBM mass production and technology development.

HBM Open Positions Overview

Candidates with semiconductor-related experience are welcome
Fresh graduates / entry-level candidates are also encouraged to apply (depending on the role)

Qualifications & Skill Requirements

Educational Background

• Electrical Engineering Electronics Mechanical Engineering Materials Science Mechatronics or related STEM fields
• Operators / Assistant Engineers: High school associate degree or above
• Shift Engineers: Bachelors degree or above preferred

Work Arrangement

• Willing to work shift schedules (4-on-3-off / 3-on-4-off) and occasional weekend duty
• Able to work in a cleanroom environment

Personal Attributes

• Strong communication skills and teamwork mindset
• Proactive resilient and capable of problem-solving
• Highly motivated to learn semiconductor equipment and advanced manufacturing technologies

HBM Equipment Shift Engineer / Assistant Engineer

Role Overview

Responsible for daily maintenance and production support of HBM manufacturing equipment to ensure stable operation and improved production efficiency.

Key Responsibilities

• Maintenance troubleshooting and repair of HBM production equipment
• Support mass production tool relocation installation and upgrades
• Collaborate with Process Engineers to improve tool uptime and process stability

Ideal Candidate

• Highly motivated to learn equipment technologies and hands-on manufacturing operations

AMHS / Automation Shift Engineer

Role Overview

Responsible for the operation and maintenance of Automated Material Handling Systems (AMHS) for HBM and backend production lines ensuring stable and efficient manufacturing logistics.

Key Responsibilities

• Maintenance of OHT OHS Stockers BWS Sorters ASRS and related systems
• Collaborate with vendors and IT teams for preventive maintenance and issue resolution
• Support automation projects and system improvements
• Prepare regular system operation and maintenance reports

Role Highlights

• Highly automated HBM production environment
• Cross-functional collaboration with vendors IT and manufacturing teams

HBM Process Shift Engineer

Role Overview

Responsible for monitoring and optimizing HBM critical processes to ensure stable production performance and yield through data-driven analysis and rapid issue resolution.

Key Responsibilities

• Support key processes such as PCVD Dry Etch Photo WET and CMP
• Monitor process performance using SPC inline defect inspection and data analysis
• Troubleshoot process abnormalities and reduce downtime
• Participate in CIP and continuous improvement initiatives

HBM Quality / Failure Analysis Engineer

Role Overview

Responsible for HBM product quality and failure analysis supporting new product introduction and mass production quality improvement.

Key Responsibilities

• Perform HBM product failure analysis (PFA / EFA)
• Analyze quality issues and identify root causes
• Collaborate cross-functionally with PI Product Test and MRB teams

Technical Highlights

• Package- and wafer-level failure analysis
• Practical experience with IATF / ISO / OHSAS standards

HBM Manufacturing Operator (OP)

Role Overview

Responsible for operating HBM production tools and executing manufacturing processes to ensure quality safety and stable production.

Key Responsibilities

• Operate production equipment and execute manufacturing processes
• Monitor tool status and report abnormalities
• Implement 6S quality and safety improvements
• Participate in training certification and re-certification programs

Work Schedule

• 12-hour rotating shifts (day/night)
• Stable schedule with comprehensive training programs

About HBM Technology The Future You Will Work On

HBM is a high-performance memory technology designed for AI GPUs and HPC
leveraging 3D stacking and advanced packaging technologies (TSV 2.5D / 3D packaging) to significantly improve bandwidth and energy efficiency.

By joining the MTB HBM Team you will:

• Directly participate in HBM mass production equipment and advanced packaging technologies
• Gain exposure to cutting-edge AI memory applications
• Build critical manufacturing and equipment expertise in a fast-growing technology field
• Have future career opportunities as a Tool Owner Project Engineer or Day-shift Engineer

Why Join MTB HBM

• Be part of the worlds most critical AI / HBM technology manufacturing
• Comprehensive equipment training and technical development
• Stable and long-term career growth in the semiconductor industry
• A friendly and supportive environment for fresh graduates and career switchers