Chip Assembly Process Engineer (mfd) 100

Coherent Corp. is the global leader in photonics designing and manufacturing advanced laser optical and material technologies used by customers worldwide across industrial communications electronics and instrumentation markets.

With a broad global footprint and deep engineering capability we combine advanced manufacturing applied innovation and customer collaboration to deliver high-performance solutions that enable critical technologies and solve complex real-world challenges.

About Coherent in Switzerland
Coherent Corp. Zurich is a key research and production hub specializing in advanced photonics engineered materials and high-power semiconductor laser technologies. Our teams develop and manufacture opto-electronic components and laser diodes for industrial optical data transmission life science and high-precision applications combining strong in-house R&D with state-of-the-art semiconductor manufacturing in an engineering-led culture.

Location:Zurich Switzerland (Onsite) Employment Type:Permanent full-time

Job Summary

As a Chip Assembly Process Engineer you will support semiconductor assembly processes with a focus on wire bonding and die bonding technologies. You will work closely with production and R&D teams to optimize manufacturing processes investigate process issues and drive continuous improvements in process stability yield and manufacturing efficiency.

Key Responsibilities

• Process ownership over chip assembly processes (die bonding wire bonding curing marking and inspection)
• Coordinate external wire bonding equipment service providers and oversee internal preventive maintenance activities to ensure optimal wire bonder performance uptime and process stability
• Manage wire bonding spare parts inventory and ensure tooling readiness to maintain continuous production and minimize downtime
• Drive continuous improvements of product performance process control yield and cost efficiency
• Analyze and document results and share findings and information with stakeholders
• Develop and implement new processes in collaboration with R&D
• Prepare and maintain work instructions and train operators and engineers
• Coordinate and support maintenance and unscheduled equipment repairs daily troubleshooting
• Engage with tool suppliers to address process requirements evaluate upgrades or new equipment solutions and qualify them for production

Qualifications

Bachelors or Masters degree in Mechanical Engineering Manufacturing Engineering Electrical Engineering Mechatronics or a related field.

13 years of hands-on experience in wire bonding or semiconductor assembly.

• Solid understanding of manufacturing processes and quality control
• Understanding of SPC and DoE; Lean Six Sigma belt is a plus
• Ability to work independently as well as to collaborate with operators technicians and engineers
• Results-oriented hands-on personality with initiative and a can-do attitude
• Experience working in a cleanroom environment is an advantage
• Strong verbal and written technical communication skills in English and German

Application Process

All candidates who wish to apply should submit a CV and cover letter outlining their interest in the position and how their skills and experience align with the requirements of the role.

Applications for this role close end of day on Friday 17 April 2026.

If you require any adjustments or accommodations during the application process please reach out to . We are committed to creating an inclusive and accessible recruitment experience and encourage applications from individuals of all backgrounds.