Your mission
The future of AI computing is light not electrons.
is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
High-performance hardware requires high-performance processes. As our
Senior Integration Engineer (m/f/d) your mission is to optimize photonic integrated circuit (PIC) manufacturing flow translating complex data into actionable insights to improve yield stability and process efficiency. You will drive cross-functional collaboration develop tailored solutions and build the tools that enable fast learning reproducibility and scalable production.
Your responsibilitiesOptimize and maintain the process of record (POR) for semiconductor manufacturing to maximize yield stability (Cp & Cpk) and product quality.
Conduct root-cause analysis implement corrective actions and drive process improvements across PIC Assembly R&D and Quality Management teams.
Perform production trials (DoE) to align process windows investigate interactions of processes and integrate new processes materials or equipment.
Develop and manage databases user interfaces and data-driven tools to enable process tracking analysis and decision-making.
Collaborate across functions driving communication and alignment between engineering production and quality teams.
Identify cross-correlations and patterns in manufacturing data proposing solutions that improve efficiency reproducibility and long-term scalability.
Your profile
Masters degree in Data Science Engineering Physics or a related technical field.
Strong experience in Python SQL and database management systems.
Proven ability to work cross-functionally manage different technical needs and translate complex data into actionable insights.
Highly solution-oriented self-driven and capable of independent investigations to improve processes.
Strong communication collaboration and ownership mindset; able to coordinate multiple stakeholders effectively.
Fluent in English; German or another European language is beneficial.
Why us
We hire for attitude and train for skills.
We encourage self responsibility and accelerate professional development.
We move fast and encourage experimentation.
You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
You can be part of a passionate international highly skilled cross functional team.
You will have access to the founders of the company.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany. Required Experience:
Senior IC
Your mission The future of AI computing is light not electrons. is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.High-performance ha...
Your mission
The future of AI computing is light not electrons.
is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
High-performance hardware requires high-performance processes. As our
Senior Integration Engineer (m/f/d) your mission is to optimize photonic integrated circuit (PIC) manufacturing flow translating complex data into actionable insights to improve yield stability and process efficiency. You will drive cross-functional collaboration develop tailored solutions and build the tools that enable fast learning reproducibility and scalable production.
Your responsibilitiesOptimize and maintain the process of record (POR) for semiconductor manufacturing to maximize yield stability (Cp & Cpk) and product quality.
Conduct root-cause analysis implement corrective actions and drive process improvements across PIC Assembly R&D and Quality Management teams.
Perform production trials (DoE) to align process windows investigate interactions of processes and integrate new processes materials or equipment.
Develop and manage databases user interfaces and data-driven tools to enable process tracking analysis and decision-making.
Collaborate across functions driving communication and alignment between engineering production and quality teams.
Identify cross-correlations and patterns in manufacturing data proposing solutions that improve efficiency reproducibility and long-term scalability.
Your profile
Masters degree in Data Science Engineering Physics or a related technical field.
Strong experience in Python SQL and database management systems.
Proven ability to work cross-functionally manage different technical needs and translate complex data into actionable insights.
Highly solution-oriented self-driven and capable of independent investigations to improve processes.
Strong communication collaboration and ownership mindset; able to coordinate multiple stakeholders effectively.
Fluent in English; German or another European language is beneficial.
Why us
We hire for attitude and train for skills.
We encourage self responsibility and accelerate professional development.
We move fast and encourage experimentation.
You have the opportunity to be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
You can be part of a passionate international highly skilled cross functional team.
You will have access to the founders of the company.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany. Required Experience:
Senior IC
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