Advanced Packaging Engineer

Ottawa - Canada

Monthly Salary: Not Disclosed

Posted on: 17 hours ago

Vacancies: 1 Vacancy

Job Summary

Social networking machine learning and big data analytics demand ever-increasing network connectivity. RANOVUS with operations in Ottawa Canada Nuremberg Germany and San Jose USA is a solutionprovider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners RANOVUSis the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking an Advanced Packaging Engineer to join our team.

As a successful candidate you will be working as the Photonic/ASIC Components integrator working with Photonics High Speed ASIC Laser design teams and Ranovus CMs to define best in class optimal assemblyprocesses for high volume Optical Engine (Module) manufacturing targeted for data center conjunction with the project team your role will be to support the micro-assemblyprocessdevelopment (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assemblyprocesses.

Responsibilities generally include

Design and develops complex sub-assemblies components and packaging as assigned.
Develops and implements changes to product design and/or the manufacturing process to achieve efficiency quality and/or cost improvements by participating in new product development programs.
Develops requirement specifications system concepts CAD generated using SolidWorks detail drawings BOMs and budgets. Makes layouts of complex assemblies and details of parts of devices mechanisms and structures.
Provides customer product design engineering for economic production; may participate in meetings with customers.
Assesses proper material tooling automation and equipment selection.
Works with manufacturing to trouble-shoot problems upgrades retrofits set-ups methods development and the development of process parameters.
Participates in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
Conduct proof of concept experiments and design other testing requirements as needed.
Develop SOPs operations and maintenance manuals.
Research new technology or development tools to remain informed of current technology.
Understanding of Lean Six Sigma tools projects and processes and ability to incorporate these into assigned engineering projects.
Reviews completed projects for accuracy clarity and completeness.
Ensures projects are compliant with all local regional and national regulatory requirements codes and controls.
Supports all company safety and quality programs and initiatives.
May perform other duties and responsibilities as assigned.

Required skills and experience include:

Experience with Photonic Laser and ASIC components and micro-assembly;
Experience in flip chip chip on chip die attachment (on wafer) fiber attachment processes;
5-10 years of solid experience in related work;
Excellent ability to solve technical scientific and experimental problems;
Excellent teamwork and communication skills.

Required education:

Masters or PhD preferredin a related engineering discipline

We appreciate the time you invest in exploring opportunities with us. At Ranovus we believe diverse perspectives and a strong sense of belonging are essential to building innovative technology and resilient teams. If your experience does not match every requirement we still encourage you to apply. We value curiosity growth and the unique strengths each person brings.

Ranovus is an equal opportunity employer and welcomes applicants from all backgrounds and lived experiences including those from equity deserving and underrepresented communities. We are committed to an accessible recruitment process in accordance with the Accessibility for Ontarians with Disabilities Act. Accommodations are available at any stage of the hiring process upon request by reaching out to our Talent team at .

We are committed to delivering a respectful and transparent candidate experience with clear and timely communication at every stage of the process. From time to time we may use technology to support elements of our hiring process. These tools are designed to enhance consistency and efficiency not replace human judgment. All hiring decisions are made by people guided by care context and fairness.

Thank you for your interest in joining Ranovus. We look forward to connecting with you.

Required Experience:

Senior IC

We are seeking an Advanced Packaging Engineer to join our team.

Design and develops complex sub-assemblies components and packaging as assigned.
Develops and implements changes to product design and/or the manufacturing process to achieve efficiency quality and/or cost improvements by participating in new product development programs.
Develops requirement specifications system concepts CAD generated using SolidWorks detail drawings BOMs and budgets. Makes layouts of complex assemblies and details of parts of devices mechanisms and structures.
Provides customer product design engineering for economic production; may participate in meetings with customers.
Assesses proper material tooling automation and equipment selection.
Works with manufacturing to trouble-shoot problems upgrades retrofits set-ups methods development and the development of process parameters.
Participates in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
Conduct proof of concept experiments and design other testing requirements as needed.
Develop SOPs operations and maintenance manuals.
Research new technology or development tools to remain informed of current technology.
Understanding of Lean Six Sigma tools projects and processes and ability to incorporate these into assigned engineering projects.
Reviews completed projects for accuracy clarity and completeness.
Ensures projects are compliant with all local regional and national regulatory requirements codes and controls.
Supports all company safety and quality programs and initiatives.
May perform other duties and responsibilities as assigned.

Required skills and experience include:

Experience with Photonic Laser and ASIC components and micro-assembly;
Experience in flip chip chip on chip die attachment (on wafer) fiber attachment processes;
5-10 years of solid experience in related work;
Excellent ability to solve technical scientific and experimental problems;
Excellent teamwork and communication skills.

Required education: