Physical failure analysis (PFA) involves the localisation imaging and characterisation of manufacturing defects in our products. Analysts will be expected to:
- Utilise a wide variety of fault localisation and imaging tools/techniques including but not limited to Scanning Electron Microscope (SEM) Transmission Electron Microscope (TEM) Energy Dispersive X-ray Spectroscopy (EDX) Focused Ion Beam (FIB) SEM-based Nanoprober
- Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
- Document findings in professional reports to be shared with various stakeholders
- Collaborate with cross-departmental teams such as Customer Quality Engineering Manufacturing and other FA labs
- Have an understanding of manufacturing processes and the root cause of defects
Job Qualification
- Bachelors or Masters degree in Electrical/Electronics/Materials Engineering
- Fresh Graduates or with not more than 2 years work experience
- Basic technical knowledge of semiconductor physics and MOSFET operations
- Knowledge of common computer software packages such as Word Excel PowerPoint etc
- Able to work with chemicals X-Ray Electron and Ion Beam tools
- Comfortable with handling small and delicate samples with tweezers
The following are not required but would be a benefit/plus:
- Experience in a laboratory/wafer fab/similar manufacturing environment
- Experience with beam tools (SEM/TEM/FIB)
- Familiar with the FA process flow and analysis techniques
- Knowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly)
- Strong problem solving skills (e.g. 8D or similar practice) attention to detail good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.
More information about NXP in Malaysia...
#LI-633a
Required Experience:
IC
Physical failure analysis (PFA) involves the localisation imaging and characterisation of manufacturing defects in our products. Analysts will be expected to:Utilise a wide variety of fault localisation and imaging tools/techniques including but not limited to Scanning Electron Microscope (SEM) Tran...
Physical failure analysis (PFA) involves the localisation imaging and characterisation of manufacturing defects in our products. Analysts will be expected to:
- Utilise a wide variety of fault localisation and imaging tools/techniques including but not limited to Scanning Electron Microscope (SEM) Transmission Electron Microscope (TEM) Energy Dispersive X-ray Spectroscopy (EDX) Focused Ion Beam (FIB) SEM-based Nanoprober
- Understand electrical failure analysis (EFA) data and determine the best PFA plan forward based on that data
- Document findings in professional reports to be shared with various stakeholders
- Collaborate with cross-departmental teams such as Customer Quality Engineering Manufacturing and other FA labs
- Have an understanding of manufacturing processes and the root cause of defects
Job Qualification
- Bachelors or Masters degree in Electrical/Electronics/Materials Engineering
- Fresh Graduates or with not more than 2 years work experience
- Basic technical knowledge of semiconductor physics and MOSFET operations
- Knowledge of common computer software packages such as Word Excel PowerPoint etc
- Able to work with chemicals X-Ray Electron and Ion Beam tools
- Comfortable with handling small and delicate samples with tweezers
The following are not required but would be a benefit/plus:
- Experience in a laboratory/wafer fab/similar manufacturing environment
- Experience with beam tools (SEM/TEM/FIB)
- Familiar with the FA process flow and analysis techniques
- Knowledge of semiconductor manufacturing processes (wafer fabrication as well as assembly)
- Strong problem solving skills (e.g. 8D or similar practice) attention to detail good communication skills (both written and verbal) and the ability to produce quality results in a timely fashion are also essential attributes.
More information about NXP in Malaysia...
#LI-633a
Required Experience:
IC
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