Electrical Engineer-Mixed signal Design

RESPONSIBILITIES:

• Drive the development of the core Lightfield Directing Array MEMS Micro-mirror technology through ownership of the design and modeling of electrical circuits and systems for both the MEMS control FPGA ASIC integration.
• Take ownership of designs and work closely with our evaluation and production teams to resolve issues through the full cycle of implementation including verification production handoff and troubleshooting.
• Manage and participate in the design fabrication test and integration of mixed-signal ASICs embedded system architectures PCBs and other electrical components and subsystems.
• Determine system and component level requirements specify system architectures and execute schematic capture.
• Analyze and model system designs - including parasitic extraction and component tolerances - to guarantee successful operation.
• Prototype build bring up troubleshoot and verify custom designs.
• Design and implement test procedures and assembly processes.
• Generate and maintain engineering documents such as requirements interfaces theory of operation test plans and reports release notes and ECOs.
• Assist with triage troubleshooting root cause analysis and sustaining activities.
• Lead design and modeling of electrical circuits and systems for production equipment.
• Improve processes and procedures and recruit mentor and guide junior engineers

BASIC QUALIFICATIONS:

• Bachelors degree in electrical engineering field or related experience
• 5 years of relevant work experience
• Experience in PCB design electronics packaging test and evaluation.
• Experience with FPGA and ASIC integration into PCB.
• Experience with mixed-signal circuit design and modeling.
• Experience with electronic fabrication and test equipment and with analysis and simulation tools.
• Excellent communication skills with experience working with a cross-functional distributed team.
• Self-starter mentality with a proactive approach to uncovering risks and managing dependencies.
• System-oriented with the ability and desire to dive deep into the smallest detail

PREFERRED QUALIFICATIONS:

An ideal candidate would have familiarity with:

• Experience with custom ASIC / silicon design modeling verification tape-out test or system integration and implementation
• Experience with electronics packaging design.
• Experience with high-voltage circuit design and modeling (>200V)
• Experience with embedded systems architecture and coding
• Experience with semiconductor and MEMS technology
• Experience with data center communication hardware