Engineer II Chip & Flowcell Assembly and Packaging

Engineer II - Chip & Flowcell Assembly and Packaging

Job Summary

We are seeking a highly motivated and hands-on Engineer II to join our Chip and Flowcell Assembly & Packaging team. This role is ideal for an early-career engineer who is eager to work directly in the lab gain deep expertise in semiconductor and biochip packaging and contribute to experimental development process characterization and assembly support.

As an Engineer II you will be closely involved in day-to-day laboratory work while also supporting senior engineers in technical interactions with external vendors and suppliers. This role provides strong exposure to both internal development and external manufacturing ecosystems.

Responsibilities

• Perform hands-on laboratory experiments to support chip and flowcell assembly and packaging development.
• Assist with development execution and documentation of packaging and assembly processes for biochips and consumables.
• Support process characterization DOE execution data collection and analysis.
• Operate maintain and help troubleshoot lab tools and assembly equipment.
• Assist with material evaluation process optimization and yield improvement activities.
• Support senior engineers in partnering with external vendors suppliers and manufacturing partners including: Preparing technical documentation and data packages; Participating in technical reviews calls and on-site visits; Supporting evaluation of vendor processes materials and capabilities.
• Collaborate with cross-functional teams including process engineering design NPI and manufacturing.
• Document experimental results procedures and learnings in a clear and organized manner.
• Support transfer of processes from development to manufacturing.
• Follow cleanroom lab safety and quality procedures.

Required Qualifications

• Bachelors degree in Mechanical Engineering Electrical Engineering Materials Science Chemical Engineering Biomedical Engineering or a related field.
• A minimum of 1-3 years of industry or relevant academic experience (internships co-ops or research experience acceptable).
• Strong interest in hands-on lab work and experimental development.
• Willingness and enthusiasm to be trained in semiconductor packaging biochip assembly and consumable manufacturing.
• Ability and interest in working with external vendors and suppliers under guidance from senior engineers.
• Strong attention to detail curiosity and a willingness to learn.
• Ability to work effectively in a fast-paced team-oriented environment.
• Excellent interpersonal written and verbal communication skills.

Preferred Experience

• Familiarity with basic semiconductor MEMS microfabrication or packaging concepts is a plus.
• Experience with data analysis DOE or lab documentation is a plus.

Candidates must have current authorization to work in the United States without the need for present or future sponsorship.

Non-Field Based Employees are required to be onsite Monday-Friday.

You may be required from time to time to visit and work at PacBio locations and for such times as the Company considers necessary for the proper performance of your duties.

All listed tasks and responsibilities are deemed as essential functions to this position; however business conditions may require reasonable accommodations for additional tasks and responsibilities.

All qualified applicants will receive consideration for employment without regard to race sex color religion national origin protected veteran status or on the basis of disability gender identity and sexual orientation.

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All qualified applicants will receive consideration for employment without regard to race sex color religion national origin protected veteran status or on the basis of disability gender identity and sexual orientation.

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