Principal Packaging Engineer
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Job Location:
Milpitas, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
Yesterday
Vacancies:
1 Vacancy
Job Summary
Break free from legacy packaging constraints and push the limits of power delivery. At Empower Semiconductor we are redefining how power is delivered to the worlds most demanding AI processors through ultra-high-frequency ultra-high-density power converters built on advanced semiconductor technologies. Based in Silicon Valley Empower is a power management technology leader at the forefront of the AI HPC and data-center applications.
We are seeking a talented and experienced Packaging Engineer to join our R&D team in Milpitas California and lead the development of next-generation power packaging this role you will architect develop and optimize advanced package-level power delivery systems from concept through high-volume production with deep ownership of electrical thermal and mechanical co-design. You will work cross-functionally with silicon design process technology reliability manufacturing and systems teams to deliver industry-first solutions that fundamentally challenge conventional semiconductor packaging and power-delivery limits.
If you thrive in a fast-paced highly collaborative environment and are motivated to solve problems at the edge of physics and manufacturing this is an opportunity to shape the future of power delivery and advanced semiconductor packaging.
Responsibilities:
- Defining substrate/package design rules process flows and material sets for new power module packages
- Driving alignment between module substrate design requirements and supplier capabilities to enable new product development and volume manufacturing of power modules
- Developing new assembly technologies run process DOEs define process windows for new package development
- Driving reliability testing and qualification of new packages in conjunction with the reliability function
- Working closely with offshore assembly and substrate partners to develop new processes
- Working closely with IC design teams to define package design rules and define packages to meet their requirements
- Collaborating with multi-functional teams within Empower Semiconductor for successful development qualification and production ramp of new module products
Job Requirements (Experience Skills and Qualifications)
- BS Degree in Electrical Engineering Mechanical Engineering Material Science.
- Minimum experience 15 years in semiconductor packaging technology.
- Experience leading multi-die packages.
- Understanding of organic laminate technologies manufacturing and supplier capabilities.
- Experience with package substrate design rules tools (including AutoCAD)
- Ability to set-up Design Rule Checks for verification of every aspect of the PCB layout
- Extensive experience collaborating with OSAT vendors/suppliers
- Experience in SMT or passive integrated package assembly
- Experience with packaging processes: Wafer Back-grinding Wafer Dicing Die Attach Wire-bonding Molding and Package Singulation. (Flip Chip is a plus)
- Knowledge of AEQ reliability automotive development process is a plus
- Knowledge of JEDEC/IPC design standards is a plus
- Occasional travel to attend technology reviews and resolve subcon/supplier issues may be required
Required Experience:
Staff IC
Key Skills
- Design
- Academics
- AutoCAD 3D
- Cafe
- Fabrication
- Java
About Company
We Minimize the Energy Footprint of the Digital Economy. Best-in-class regulators deliver highest power density and performance with fewer components.
