Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development. The Technologist Hardware Development Engineering will be responsible to develop new CMP process and technology enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle.
- Partner with wafer wet process development engineers and technicians responsible for CMP new process development methodology setup consumables and advance tooling delivery to meet new product launch requirement schedule and manufacturability.
- Work with cross functional teams including design integration and other development process modules on designs incorporating CMP or resolving any integration issue.
- Lead on trouble-shoot the related issues in development line conduct defect analyses root cause analyses and implement corrective and preventive actions.
- Responsible for new process to manufacturing engineering (ME) transferring support ME team on necessary process implementing and manufacturing ramping.
- Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis. Build statistically solutions to provide feedback guidance to improve process development performance.
Qualifications :
REQUIRED
- PhD degree in physics chemistry chemical engineering materials science or a related engineering field.
- At least 5 year of knowledge / working experience on CMP process development and post cleaning processes.
- Understanding other process techniques such as photolithography dry or wet etching electroplating or thin film deposition processes
- Experience in wafer-level magnetic recording head fabrication and integration are desirable.
- Excellent communication skills both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.
- Demonstrated leadership and project driving skills capable of managing team and projects with set milestones and timeline and ability to execute.
- Experience with statistical analysis tools such as JMP is a plus.
Additional Information :
All your information will be kept confidential according to EEO guidelines.
Compensation & Benefits Details
Notice To Candidates: Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests please report it immediately to Western Digital Ethics Helpline or email .
Remote Work :
No
Employment Type :
Full-time
Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development. The Technologist Hardware Development Engineering will be responsible to develop new CMP process and technology enable and accelerate technology deployment into head products to meet HDD require...
Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development. The Technologist Hardware Development Engineering will be responsible to develop new CMP process and technology enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle.
- Partner with wafer wet process development engineers and technicians responsible for CMP new process development methodology setup consumables and advance tooling delivery to meet new product launch requirement schedule and manufacturability.
- Work with cross functional teams including design integration and other development process modules on designs incorporating CMP or resolving any integration issue.
- Lead on trouble-shoot the related issues in development line conduct defect analyses root cause analyses and implement corrective and preventive actions.
- Responsible for new process to manufacturing engineering (ME) transferring support ME team on necessary process implementing and manufacturing ramping.
- Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis. Build statistically solutions to provide feedback guidance to improve process development performance.
Qualifications :
REQUIRED
- PhD degree in physics chemistry chemical engineering materials science or a related engineering field.
- At least 5 year of knowledge / working experience on CMP process development and post cleaning processes.
- Understanding other process techniques such as photolithography dry or wet etching electroplating or thin film deposition processes
- Experience in wafer-level magnetic recording head fabrication and integration are desirable.
- Excellent communication skills both written and oral. Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.
- Demonstrated leadership and project driving skills capable of managing team and projects with set milestones and timeline and ability to execute.
- Experience with statistical analysis tools such as JMP is a plus.
Additional Information :
All your information will be kept confidential according to EEO guidelines.
Compensation & Benefits Details
Notice To Candidates: Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests please report it immediately to Western Digital Ethics Helpline or email .
Remote Work :
No
Employment Type :
Full-time
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