Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.
What We Offer
Salary:
$176000.00 - $242000.00Location:
Santa ClaraCAYoull benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials we care about the health and wellbeing of our employees. Were committed to providing programs and support that encourage personal and professional growth and care for you at work at home or wherever you may go. Learn more about our benefits.
Key Responsibilities:
Process Integration & Development: Define develop andoptimizeadvanced packaging process flows (e.g. TSV RDL bump hybrid bonding die stacking).
Cross-Functional Collaboration: Lead technical projects to integrate packaging needs into product designs ensuring Design for Manufacturability (DFM) and Design for Reliability (DFR).
Design of Experiments (DOE): Plan and execute wafer-level and package-level experiments tooptimizeunit processes (dielectric deposition plating etching CMP bonding).
Yield & Failure Analysis: Analyze electrical physical and defect data to root-cause yield limiters and implement corrective actions.
Vendor Management: Collaborate with OSATs and substrate manufacturers to define equipment/material roadmaps track NPI (New Product Introduction) and ensure ramp-up readiness.
Technical Leadership: Proactivelyidentifyand mitigate risks related to silicon-to-package interaction (SPI) warpage and thermal management
Leadadvanced packagingprocess integrationfor high performance interconnectandmicroLEDpanel.The job requires providing solutions that are highlycreative anddirectly contribute to product differentiation.Will beresponsibleto establishintegration flow withmanufacturability and reliability.Work closely withfab assembly substrate connector partnersandcollaborate with multi-functional teams withinAppliedandexternal partners
Teams up with Design & Engineering modules (designprocesspackaging metrologyteams)todeliver successful products
Teams up with Product Marketing to understand the Product Marketing plans and Product Roadmap
Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
Yes 10% of the TimeRelocation Eligible:
YesThe salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.
For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.
Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.
Required Experience:
IC
Applied Materials, Inc. is the global leader in materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic (PV) industries.