Interconnect DesignRTL

Business Line Description:
NXPs Advance Chip Engineering (ACE) team is a central engineering organization responsible for developing and delivering Systems-on-a-Chip (SoCs) for NXPs Automotive Edge and Radar Processing business lines. MMEs SoC Hardware Architecture team produces architectural solutions covering the very wide range of SoCs required by the business lines. The team is challenged to produce industry-leading solutions covering very cost-sensitive low-power devices to highly integrated high-performance multi-domain devices compliant with the latest automotive and industrial safety and security standards.

Jobs Summary

Network-on-Chip interconnects architecture aims to replace traditional interconnects such as buses or crossbars with one that is highly structured and scalable with layered Nxp this has been used extensively in various product categories. This position will be

Responsible for Micro-architecture specifications and detailed design of interconnects (NoCs/NICs) and related IPs based on the understanding of system-level use-cases

Work with multiple platform architecture domains such as I/Os Audio Networking PCI-E CPU/GPU/Multimedia/DDR etc. to define new platform interconnect solutions across IoT/Automotive/Edge Processing/Radar and other domains

Actively work very closely with SoC team verification team physical design team Soc Floorplan and core teams to come up with appropriate NoC topology/structure which is optimal in area/performance. Collaborate will the team throughout the entire product development cycle to ensure your solution is successfully deployed in commercial product

Come up with innovative solutions for partitioning the Interconnect which will be implementation friendly.

Responsible for (Full/IO) coherent interconnect interconnect in various cores/ subsystems solutions

Actively work with the SoC performance team to make sure the Interconnect meets all the performance requirements and with the silicon validation team to co-relate pre-silicon and post-silicon assumptions.

Work very closely with the third-party NoC technology providers to decide on the direction of future interconnect technology in Nxp products

Key Challenges:

Experience in designing or architecting complex SoCs in leading-edge process nodes with multiple independent compute environments

Exposure to ISO26262-compliant and mixed-criticality architectures

Ability to work at the system level identifying optimal partitioning of solutions between hardware and software working closely with software architects

Track record of assessing performance power and area tradeoffs and determining the correct balance for a given product type

Experience in defining IP components to solve system issues.

High motivation and results orientation

Strong problem-solving skills

Excellent interpersonal skills including written and verbal communication

Teamwork negotiation and presentation skills

Willing and able to mentor junior engineers

Job Qualifications:

BTech/MTech/Ph.D. in Electrical/Computer Engineering or other similar disciplines with at least 5years of relevant experience.

Understand interconnect protocols like AHB/AXI/ACE/ACE-Lite/NoC concepts.

Good knowledge of Digital Design and RTL development - Hands-on experience with SoC Design Verilog RTL coding

Understanding of multi-core ARMv8/v9 CPU architecture coherency protocols and virtualization

Working knowledge of Synthesis DFT verification and silicon debug.

Working knowledge of Lint CDC PLDRC CLP etc

Basic Knowledge of System Architecture

Familiarly with system design SOC micro-architecture and/or design

Job locations:

Noida India
Bengaluru India

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