Staff Integration Engineer

Albany, GA - USA

Monthly Salary: Not Disclosed

Posted on: Yesterday

Vacancies: 1 Vacancy

Job Summary

PsiQuantumsmission is to build the first useful quantum computersmachines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016 our singular focus has been to build and deploy million-qubit fault-tolerant quantum systems.

Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy pharmaceuticals finance agriculture transportation materials and other foundational industries.

Our architecture and approachisbased on silicon photonics. Byleveragingthe advanced semiconductor manufacturing industryincluding partners like GlobalFoundrieswe use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photonsdontfeel heat are immune to electromagnetic interference and integrate with existing cryogenic cooling and standard fiber-optic infrastructure.

In 2024PsiQuantumannounced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane Australia and Chicago Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically definingand that now is the time to scale.

PsiQuantumalso develops the algorithms and software needed to make these systems commercially valuable. Our application software and industry teams work directly with leading Fortune 500 companiesincluding Lockheed Martin Mercedes-Benz Boehringer Ingelheim and Mitsubishi Chemicalto prepare quantum solutions for real-world impact.

Quantum computing is not an extension of classical computing. Itrepresentsa fundamental shiftand a path to mastering challenges that cannot besolvedany other way. The potential is enormous and we have a clearpathto make it real.

Come join us.

Job Summary:

PsiQuantum is building the worlds first commercially viable quantum computer powered by silicon photonics. Our Foundry Engineering team partners with leading semiconductor manufacturers to co-develop advanced silicon-based photonic platforms that enable scalable quantum systems.

In this role you will lead the development and integration of optical interposer and advanced packaging technologies that form the foundation of PsiQuantums photonic quantum architecture. This work spans wafer-level processing heterogeneous integration packaging co-design and materials development to deliver high-yield high-performance optical interfaces connecting photonic and electronic subsystems.

The ideal candidate will have deep experience in optical interposer process integration including photonic waveguide integration optical I/O coupling and wafer-level packaging. You will collaborate closely with PsiQuantums design packaging and foundry partners to bring next-generation optical interconnect technologies from concept to production readiness.

Responsibilities:

Lead the process development and integration of optical interposer modules including photonic waveguide layers and precision optical coupling structures.
Develop and qualify wafer-level processes for photonic and optoelectronic integration including alignment bonding and encapsulation for optical performance and reliability.
Define design rules process assumptions and wafer acceptance criteria for optical interposer and packaging modules.
Drive co-design across photonic electrical and mechanical domains to optimize performance manufacturability and yield.
Partner with foundry and packaging vendors to develop optical I/O solutions such as fiber attach and photonicelectronic co-packaging.
Analyze inline metrology optical loss measurements and defect data to identify and resolve yield limiters.
Establish process controls statistical methods (Cp/Cpk) and reliability test protocols for new optical and packaging modules.
Collaborate with multi-disciplinary teams to support materials selection tool evaluation and computational modeling for next-generation optical integration schemes.

Experience/Qualifications:

M.S. or Ph.D. in Electrical Engineering Materials Science Applied Physics or a related field.
10 years of experience in semiconductor or photonic process integration optical packaging or heterogeneous photonic integration.
Proven experience inoptical interposer development including silicon photonics glass/silicon interposer platforms or wafer-level photonic packaging.
Familiarity withoptical coupling techniques (fiber attach grating couplers lens alignment) and low-loss photonic integration processes.
Demonstrated ability to managecross-functional development programs with external foundry and OSAT partners.
Experience withinline optical metrology wafer-level testing yield improvement and defect reduction.
Understanding ofadvanced packaging technologies including hybrid bonding chiplet integration or co-packaged optics is strongly preferred.
Track record of developing and transferring new process modules from R&D to pilot or production environments.
Excellent communication and problem-solving skills with a hands-on approach and ability to thrive in a fast-paced collaborative setting.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race color religion sex (including pregnancy childbirth or related medical conditions) gender identity gender expression national origin ancestry citizenship age physical or mental disability military or veteran status marital status domestic partner status sexual orientation genetic information or any other basis protected by applicable laws.

Note: PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask you for bank account information as part of the interview process. Please report any suspicious activity to .

We are not accepting unsolicited resumes from employment agencies.

Required Experience:

Staff IC

Come join us.

Job Summary:

Responsibilities:

Lead the process development and integration of optical interposer modules including photonic waveguide layers and precision optical coupling structures.
Develop and qualify wafer-level processes for photonic and optoelectronic integration including alignment bonding and encapsulation for optical performance and reliability.
Define design rules process assumptions and wafer acceptance criteria for optical interposer and packaging modules.
Drive co-design across photonic electrical and mechanical domains to optimize performance manufacturability and yield.
Partner with foundry and packaging vendors to develop optical I/O solutions such as fiber attach and photonicelectronic co-packaging.
Analyze inline metrology optical loss measurements and defect data to identify and resolve yield limiters.
Establish process controls statistical methods (Cp/Cpk) and reliability test protocols for new optical and packaging modules.
Collaborate with multi-disciplinary teams to support materials selection tool evaluation and computational modeling for next-generation optical integration schemes.

Experience/Qualifications:

M.S. or Ph.D. in Electrical Engineering Materials Science Applied Physics or a related field.
10 years of experience in semiconductor or photonic process integration optical packaging or heterogeneous photonic integration.
Proven experience inoptical interposer development including silicon photonics glass/silicon interposer platforms or wafer-level photonic packaging.
Familiarity withoptical coupling techniques (fiber attach grating couplers lens alignment) and low-loss photonic integration processes.
Demonstrated ability to managecross-functional development programs with external foundry and OSAT partners.
Experience withinline optical metrology wafer-level testing yield improvement and defect reduction.
Understanding ofadvanced packaging technologies including hybrid bonding chiplet integration or co-packaged optics is strongly preferred.
Track record of developing and transferring new process modules from R&D to pilot or production environments.
Excellent communication and problem-solving skills with a hands-on approach and ability to thrive in a fast-paced collaborative setting.