Advanced Packaging, SIPI Principal Engineer

31 MSI

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profile Job Location:

Boise, ID - USA

profile Monthly Salary: Not Disclosed
Posted on: 17 hours ago
Vacancies: 1 Vacancy

Job Summary

About Marvell

Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.

At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.

Your Team Your Impact

The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical mechanical thermal and system requirements for the next generation high performance computing (HPC) Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity power integrity thermal integrity mechanical integrity high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip multiple component configurations involving but not limited to 2.5D and 3D packages Co-packaged copper or optics and advanced substrates. Marvell has partnered with the worlds leading manufacturers to solve our customers most challenging designs and integrations with industry-leading packaging technologies

What You Can Expect

You will be responsible for the following:

  • SI/PI analysis of designs and optimization within 2D/2.5D/3D packages

  • Interfacing with product design teams and clients for optimized floor-planning package substrate design and power delivery network design

  • Perform wiring studies in order to determine optimal signal routing power delivery verification and package size determination

  • Training and mentoring within a growing team of Signal and Power Integrity engineers

Primary job location is Burlington VT with options for Westborough MA or Boise ID. Job requires being on-site in office 5 days per week.

What Were Looking For

The ideal candidate will have an interest in hardware design and experience working on signal and power integrity verification and design optimization. People and/or team leadership is a strong plus. A knowledge of Electrical Engineering concepts circuit extractions and simulation as well as design methodology and strategies is addition the candidate will possess a bachelors degree in electrical engineering or related fields and 10 years of related professional experience in package or PCB design or masters degree and/or PhD in Electrical Engineering with coursework in signal integrity and power delivery and 8 years of experience.

Marvell is looking for an expert with demonstrated success in the following areas:

  • Evaluating package or PCB designs for challenging electrical requirements

  • Close interaction with physical designers and IP teams to optimize electrical performance

  • Executing simulation tasks for signal and power integrity sign-off

Skills needed to be successful in this role:

  • Understanding of signal integrity and power integrity concepts and fundamentals

  • Experience in package development including interposer design

  • People management or technical leadership

  • Experience with EDA simulation tools such as Ansys HFSS Keysight ADS Cadence Sigrity tools

  • Familiarity with packaging technologies materials package substrate design rules and assembly rules

  • Experience with simulation and analysis using tools like PowerSI SIwave

  • Working knowledge of circuit extractions and simulations

  • Ability to work with engineers in multiple locations and geographies

  • Strong communication presentation and documentation skills

The ideal candidate would have:

  • Board and system level signal and power integrity analysis

  • Good understanding of interposer substrate package PCB level design rules ability to perform routing feasibility studies using Cadence APD or PCB editor.

  • Understanding of signal and power integrity for 2.5D/3D packages including (a) CoWoS-S/R/L (b) EMIB (c) CPO (d) CPC

  • Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.

  • Interested in being a leader in growing team

Expected Base Pay Range (USD)

148500 - 219780 $ per annum

The successful candidates starting base pay will be determined based on job-related skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

At Marvell we offer a total compensation package with a base bonus and and financial wellbeing are part of the package. That means flexible time off 401k plus a year-end shutdown floating holidays paid time off to volunteer. Have a question about our benefits packages - health or financial Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .

Interview Integrity

As part of our commitment to fair and authentic hiring practices we ask that candidates do not use AI tools (e.g. transcription apps real-time answer generators like ChatGPT CoPilot or note-taking bots) during interviews.

Our interviews are designed to assess your personal experience thought process and communication skills in real-time. If a candidate uses such tools during an interview they will be disqualified from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations including the Export Administration Regulations (EAR). As such applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens lawful permanent residents or protected individuals as defined by 8 U.S.C. 1324b(a)(3) all applicants may be subject to an export license review process prior to employment.

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Required Experience:

Staff IC

About Marvell Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.At Marvell you can affect the arc of individual lives ...
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Key Skills

  • Design
  • Academics
  • AutoCAD 3D
  • Cafe
  • Fabrication
  • Java

About Company

Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.

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