Principal Advanced Packaging Design Engineer

31 MSI

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profile Job Location:

Burlington, CO - USA

profile Monthly Salary: Not Disclosed
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

About Marvell

Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.

At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.

Your Team Your Impact

The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical mechanical thermal and system requirements for the next generation high performance computing (HPC) Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity power integrity thermal integrity mechanical integrity processability manufacturability and reliability involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip multiple component configurations involving but not limited to 2.5D and 3D packages Co-packaged copper or optics and advanced substrates. Marvell has partnered with the worlds leading manufacturers to solve our customers most challenging designs and integrations with industry-leading packaging technologies.

What You Can Expect

This engineer will be responsible for leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions. The engineer will also interface with package suppliers to select package technology to ensure manufacturability and compliance with performance reliability and cost requirements.

What Were Looking For

  • Extensive experience in substrate and/or board design for advanced package technologies with basic understanding of design for manufacturing and reliability as well as electrical performance and the ability to make trade off decisions accordingly

  • Proven ability to lead complex package architecture development projects involving all relevant internal and external customer stakeholders

  • Mastery in tools and workflows: Cadence 3DIC/ISP/APD/SiP

  • Bachelors degree in electrical engineering or related fields and 15 years of related professional experience or masters degree and 12 years of related professional experience or PhD degree with 8 years of experience.

Skills needed to be successful in this role:

  • Innovative thinking fundamental understanding of design rules breakout place and route signal shielding reference plane power distribution pinout considering overall package and system requirements.

  • Experience with current generation HBM DDR SerDes D2D D2H ADC DAC PCIE Ethernet etc

  • Good understanding of signal and power integrity at substrates board package and system level.

  • Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L (b) EMIB (c) CPO (d) CPC

  • Familiarity in tools and workflows: Cadence Sigrity/Clarity/Innovus/Virtuoso Ansys AutoCAD SolidWorks

  • Experience contributing to tool process and flow development library maintenance

  • Experience interacting with chip design and electrical simulation teams to optimize the design. Familiarity with running and interpreting signal and power simulations is a plus

  • Ability to manage programs involving cross-functional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.

  • Strong communication presentation and documentation skills

Expected Base Pay Range (USD)

148500 - 219780 $ per annum

The successful candidates starting base pay will be determined based on job-related skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

At Marvell we offer a total compensation package with a base bonus and and financial wellbeing are part of the package. That means flexible time off 401k plus a year-end shutdown floating holidays paid time off to volunteer. Have a question about our benefits packages - health or financial Ask your recruiter during the interview process.

All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .

Interview Integrity

As part of our commitment to fair and authentic hiring practices we ask that candidates do not use AI tools (e.g. transcription apps real-time answer generators like ChatGPT CoPilot or note-taking bots) during interviews.

Our interviews are designed to assess your personal experience thought process and communication skills in real-time. If a candidate uses such tools during an interview they will be disqualified from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations including the Export Administration Regulations (EAR). As such applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens lawful permanent residents or protected individuals as defined by 8 U.S.C. 1324b(a)(3) all applicants may be subject to an export license review process prior to employment.

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Required Experience:

Staff IC

About Marvell Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.At Marvell you can affect the arc of individual lives ...
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Key Skills

  • Design
  • Academics
  • AutoCAD 3D
  • Cafe
  • Fabrication
  • Java

About Company

Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.

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