This role is highly specialized in semiconductor packaging design requiring strong EDA tool proficiency and knowledge of advanced packaging technologies.
Key Responsibilities & Skills:
- Tools & Knowledge:
- Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).
- Technical Expertise:
- Multi-layer package design experience.
- Understanding of substrate manufacturing Design Rules and Assembly Rules.
- Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.
- Flip-chip package design concepts.
- Tasks:
- Perform point-to-point connections.
- Run DRC (Design Rule Checks) identify root causes and fix issues.
- Execute design based on provided schematics including component placement and constraint setup.
This role is highly specialized in semiconductor packaging design requiring strong EDA tool proficiency and knowledge of advanced packaging technologies. Key Responsibilities & Skills: Tools & Knowledge: Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA). Techni...
This role is highly specialized in semiconductor packaging design requiring strong EDA tool proficiency and knowledge of advanced packaging technologies.
Key Responsibilities & Skills:
- Tools & Knowledge:
- Mentor/Siemens and Cadence tools (especially for Package Layout Automation - PLA).
- Technical Expertise:
- Multi-layer package design experience.
- Understanding of substrate manufacturing Design Rules and Assembly Rules.
- Familiarity with SIPI (Signal Integrity & Power Integrity) Rules.
- Flip-chip package design concepts.
- Tasks:
- Perform point-to-point connections.
- Run DRC (Design Rule Checks) identify root causes and fix issues.
- Execute design based on provided schematics including component placement and constraint setup.
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