IC Package Designer (Semiconductor)
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Job Location:
San Jose, CA - USA
Monthly Salary:
Not Disclosed
Posted on:
12 days ago
Vacancies:
1 Vacancy
Job Summary
Job Title: IC Package Designer
Experience:5 Years
Location:San Jose (Work from Office / Onsite)
Were looking for anexperienced Packaging Designerto develop creative and cost-effective IC package designs.
Job Description:
Netlist & BGA creation
Substrate stack-up & routing strategy definition
Experience withRF Digital High-speed & Mixed-signal die
Strong knowledge ofSI/PI requirements(DDR SERDES etc.)
Expertise inUCIE (Advanced & Standard)HBMCoWoS2.5D/3D RDL Flip Chip and Wire Bondtechnologies
Familiar withHDI substrates DRC setup and OSAT rules
Proficiency inCadence Allegro Package Designer
Qualification:
Bachelors in Electronics/Electrical Engineering
5 years in IC package design & development
Experience:5 Years
Location:San Jose (Work from Office / Onsite)
Were looking for anexperienced Packaging Designerto develop creative and cost-effective IC package designs.
Job Description:
Netlist & BGA creation
Substrate stack-up & routing strategy definition
Experience withRF Digital High-speed & Mixed-signal die
Strong knowledge ofSI/PI requirements(DDR SERDES etc.)
Expertise inUCIE (Advanced & Standard)HBMCoWoS2.5D/3D RDL Flip Chip and Wire Bondtechnologies
Familiar withHDI substrates DRC setup and OSAT rules
Proficiency inCadence Allegro Package Designer
Qualification:
Bachelors in Electronics/Electrical Engineering
5 years in IC package design & development
Required Skills:
FLIP CHIPSERDES
Key Skills
- Load & Unload
- Ruby
- Shipping & Receiving
- Forklift
- Lift Truck Experience
- Basic Math
- Packaging
- Warehouse Experience
- Delivery Driver Experience
- Heavy Lifting
- Human Resources
- RF Scanner
