Internship at Swiss PIC
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Job Location:
Brugg - Switzerland
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
Swiss Photonics Integration Center (Swiss PIC) provides precision assembly and characterization solutions for Swiss industry especially start-ups and SMEs. High-speed systems are widely demanded in optical communications sensing quantum computing etc. and testing and qualification are crucial steps to verify the products performance. The center which is located in the Switzerland Innovation Park InnovAARE next to the Paul Scherrer Institute (PSI) is investing in qualified industrialized processes clean environmentally controlled fabs high-tech machinery and has built up a full production line for optical and electrical precision assembly.
The Opportunity: We are seeking an intern to contribute to our high-frequency RF and electro-optical characterizations for a minimum duration of 3 months. If you are experienced in RF or EOM characterization or familiar with the related lab equipment you are highly encouraged to apply otherwise an openness to learn and readiness to tackle the task at hand while learning from our experienced specialists is a must. If this is of your interest send your application to join our international and dynamic team of experts dedicated to pushing the boundaries of what is possible in photonics and shape the future of technologies within communication computing quantum and beyond.
Tasks
- Systematic test and iteration on interface designs using state-of-the-art tools and methodologies to extract best designs for high-frequency interfacing
- Characterize and qualify the developed solutions and technical documentation of the results
- Closely collaborate with the design and process engineering teams to develop and improve solutions that meet performance requirements and manufacturing constraints.
- Clear and timely reporting to Swiss PIC experts
Requirements
- Bachelor master or PhD in Electrical Engineering Physics or a related field.
- Hands on characterization equipment such as vector network analyzers (VNAs) or Lightwave component analyzers (LCAs)
- Experience with chip facet polishing tools is a plus.
- Technical documentation skills and systematic reporting. Self-motivated and able to work independently.
- Strong analytical and problem-solving skills with the ability to troubleshoot complex issues and propose effective solutions.
- Experience with semiconductor packaging microelectronics or micromechanics is a plus.
- Solid communication skills in English required.
Benefits
- Opportunity to work on groundbreaking technology at the forefront of the industry shaping the future of communication and computing.
- International Collaborative and inclusive team culture that values creativity diversity and continuous learning.
- Personal responsibility in your job and the chance to grow with us.
- Our passion to bring PICs to every days life.
Employment rate: 60% or by arrangement Place of work: Villigen Switzerland Start date: from November 2025 Duration: at least 3 months
How to Apply: We look forward to receiving your application including:
- Your CV
- (Optional) A statement of interest relating the position to your skills
- (Optional) Grades or work certificates or references if available
Applications will be reviewed on a rolling basis with priority given to those submitted before 01.11.2025.
Key Skills
- Risk Management
- Conflict Resolution
- Incident Reports
- Justices
- Legislative Process
- Emergency
- Rescue Operations
- safety compliance
- Professional Development
- Access Control
- Personnel Management
- Safety Management
- Risk Assessments
- General Public
- Social Events
About Company
With the ever-increasing demand of photonic systems in existing and future markets including optical communications, sensing, quantum computing, autonomous driving, AI, AR/VR, medical, and many others, the complexity of photonic packaging is also increasing. Common challenges for Swis ... View more
