Advanced Device Modeling Expert TCAD

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

What We Offer

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About the Role

We are working on exciting projects connecting materials to systems to drive new innovations that enable a wide range of advanced Logic-Memory devices and technologies and associated material and processes interactions. You can be part of this cutting-edge modeling and design team where you will have the opportunity to model and simulate new technologies that answers the continuous demands for scaled devices denser interconnects that significantly improves the system Power Performance and Area (PPA).

We are looking for an expert highly experienced Senior Engineer to join our Advanced Device Modeling team onsite in Santa Clara CA.

This primary responsibility of this position will be to focus on DTCO modeling to support the unit process and integration flow development for next generation logic and DRAM nodes. You will play a key role in shaping the future of advanced logic and DRAM technologies by providing DTCO simulation-driven insights that influence materials process and design decisions.

This position offers the opportunity to work at the forefront of semiconductor innovation collaborating with engineers and researchers across multiple business units including design process integration reliability and manufacturing.

Key Responsibilities

• Development of TCAD process and device models to enable predictive analysis for advanced logic (FinFET GAA CFET) and DRAM architectures (6F2 4F2 VCT and 3D DRAM)

• Development and modification of speculative process integration schemes and risk/benefit assessment.

• Extraction of compact model representation of TCAD simulated devices.

• Layout development/design of standard logic cells and DRAM array

• Interconnect modeling and parasitic resistance and capacitance extraction

• SPICE modeling and PPA projection for benchmark logic circuits & blocks and DRAM array / periphery

• Collaborate with cross-functional teams to define simulation requirements interpret results and provide actionable design and process recommendations.

• Support technology roadmap development by evaluating new materials interconnect structures process flows and design.

• Drive design-of-experiment (DOE) studies and sensitivity analyses to understand key drivers of electrical performance and reliability.

• Contribute to the development and automation of internal simulation workflows tools and best practices to improve modeling efficiency and accuracy.

• Document and present simulation methodologies results and recommendations to both technical and executive audiences.

• Stay current with industry trends emerging technologies and academic research in advanced packaging and simulation methodologies.

Required Qualifications

• Masters or Ph.D. in Electrical Engineering Materials Science Applied Physics or a related field.

• 5 years of hands-on industry experience with Synopsys 3D TCAD process device parasitic extraction and spice modeling tools towards logic or memory technology development.

• Strong fundamental understanding of semiconductor device physics related to logic and DRAM technologies.

• Familiarity with logic (FinFET GAA and CFET) and DRAM process integration flows (FEOL / MOL / BEOL) and 3D device structures.

• Experience with logic benchmark circuits and PPA evaluation methodologies.

• Experience with DRAM array and periphery operation.

• Experience with scripting and automation (e.g. Python TCL MATLAB) to streamline simulation workflows.

• Excellent analytical problem-solving and communication skills.

• Proven ability to work independently and collaboratively in a fast-paced cross-functional environment.

• Strong problem-solving abilities in interdisciplinary areas

• Ability to present scientific and/or experimental results in a concise and convincing manner

• Desire to stay up to date with industry challenges and recent advancements

• Passionate and highly motivated to learn new things

Preferred Qualifications

• Experience with device and circuit level reliability modeling

• Recent experience withwriting research papers for conference and journal publications

• Experience with standard cell characterization RTL synthesis DRC/LVS and place-and-route and timing analysis flows

• Experience in calibration to hardware/measurements and correlations

Additional Information

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The salary offered to a selected candidate will be based on multiple factors including location hire grade job-related knowledge skills experience and with consideration of internal equity of our current team addition to a comprehensive benefits package candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program as applicable.

For all sales roles the posted salary range is the Target Total Cash (TTC) range for the role which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.

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