New Graduate Hiring Molding Equipment Engineer

NXP Semiconductors

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profile Job Location:

Kaohsiung City - Taiwan

profile Monthly Salary: Not Disclosed
Posted on: 30+ days ago
Vacancies: 1 Vacancy

Job Summary

Job Description

  • Responsible for Assembling Back-End - Molding Equipment.

  • Machine improvement. (OU/MTBA/Productivity).

  • Spare parts management cost reduction.

  • Mold tool management.

  • SOP definition SOP compliance machine standardization.

  • Automation project.

Requirements

  • Bachelor degree and above. Major in Mechanical and Automation Engineering related fields.

  • Proactive mind curiosity and want to learn communication skills by using English.

  • Familiar with AUTOCAD.

  • Having experience with equipment maintenance or improvement is a plus.

  • Having experience with mold tool design or maintenance is a plus.

  • Having experience with equipment automation is a plus.


More information about NXP in Greater China...

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Job DescriptionResponsible for Assembling Back-End - Molding Equipment.Machine improvement. (OU/MTBA/Productivity).Spare parts management cost reduction.Mold tool management.SOP definition SOP compliance machine standardization.Automation project.RequirementsBachelor degree and above. Major in Mecha...
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Key Skills

  • Clerical
  • Engineering
  • Assembly Language
  • Credit
  • Clinical

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NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.

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