Senior Engineer (Wirebond Process Development)

Seremban - Malaysia

Monthly Salary: Not Disclosed

Posted on: 30+ days ago

Vacancies: 1 Vacancy

Job Summary

About the role

The Senior Engineer(Wirebond Process Development) is responsible for the design development optimisation and industrialisation of wire bonding processes for advanced semiconductor packaging. This role supports New Product Introductions (NPI) technology roadmap projects and continuous process improvement in high-volume manufacturing (HVM). The engineer ensures process robustness high yield and scalability while working with cross-functional teams including R&D equipment engineering quality and operations.

What you will do

1. Process Development & NPI Enablement

Develop and qualify new wire bonding processes (ball/wedge bonding Cu/Ag/Au wires) for leadframe TSSOP VSSOP DHVQFN and advanced packaging platforms.
Define optimal bonding parameters including bonding force ultrasonic power time temperature and capillary design.
Support process characterisation material compatibility studies and engineering build reviews for NPI.

2. Technology Roadmap & Advanced Materials

Evaluate and implement advanced bonding technologies such as fine pitch bonding low-looping stitch-on-ball (SoB) dual bonding or hybrid bonding.
Work with wire vendors (Tanaka Heraeus AP&C) to evaluate and qualify new wire types (e.g. Pd-coated Cu Ag alloy) for reliability and performance.
Lead investigations into new capillaries bonding tools and surface finishes to improve bondability and reliability.

3. Yield Improvement & Defect Reduction

Analyse bonding defects (e.g. non-stick-on-pad (NSOP) heel crack wire sweep ball-off stitch lift etc.) using structured problem-solving tools (8D DMAIC).
Drive yield enhancement projects by optimising parameters improving materials and refining process windows.
Perform DOE and data analysis to identify critical parameters and interactions affecting quality and throughput.

4. Equipment Integration & Automation

Collaborate with equipment vendors (K&S ASM Hesse Mechatronics Shinkawa) to implement new features software updates or process controls.
Lead equipment evaluation buy-off and qualification for new wire bonders or tooling in support of capacity expansion and technology upgrades.
Support transition from lab to HVM ensuring process stability reproducibility and operator readiness.

5. Cross-functional Collaboration

Work closely with product engineering quality layout design and reliability teams during new product development and ramp-up.
Interface with global R&D package development and customer engineering teams for design reviews and technical discussions.
Participate in technical audits customer visits and troubleshooting sessions as a wire bonding subject matter expert (SME).

6. Documentation & Process Control

Create and maintain technical documentation: Process Specs Control Plans PFMEA WI/SOP parameter sheets.
Define critical process control points implement Statistical Process Control (SPC) and lead continuous improvement initiatives (Kaizen Lean).

What you will need

Bachelors or Masters degree in Materials Science Electrical Engineering Mechanical Engineering or a related field.
Minimum 5 years in semiconductor wire bonding process development or engineering.
Proven experience in Cu/Ag/Au wire bonding fine-pitch or high-pin-count bonding and new product qualifications.
Strong understanding of bonding theory metallurgy and wire-material-substrate interactions.
Skilled in equipment troubleshooting bonding profile tuning and defect analysis.
Proficient in JMP Minitab or equivalent tools for DOE and statistical analysis.
Excellent project management communication and cross-functional leadership skills.
Familiar with automotive JEDEC and AEC-Q100 reliability standards for bonding.

Why Join Us Be the Architect of Our Growth

This is a unique opportunity to step into a high-impact role during a major organizational milestone. We are currently executing a significantfactory expansion project and we needdynamic innovative engineersto make it a success.

For further inquiries about the role please contact.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.

In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Required Experience:

Senior IC

About the roleThe Senior Engineer(Wirebond Process Development) is responsible for the design development optimisation and industrialisation of wire bonding processes for advanced semiconductor packaging. This role supports New Product Introductions (NPI) technology roadmap projects and continuous p...