Thesis work Thermal and Electrical Optimization of Inverter PCB Design

About this opportunity - Background

Within the scope of Volvo Cars Electrification Strategy the Power Electronics team in Vehicle Propulsion is advancing the development of both hardware and software for Inverter systems. Our goal is to achieve world-class performance with a strong emphasis on energy efficiency and sustainability. To support this we aim to deepen our expertise and enhance capabilities in modeling and simulation of inverter system performance by leveraging the latest technological tools and methodologies.

Scope of the thesis work

This study aims to systematically investigate thermal and electrical performance of printed circuit boards (PCBs) through simulation and modeling using Ansys Icepack Sherlock and SIwave with the goal of optimizing thermal management and EMI/EMC performance.
The thermal simulation will focus on temperature profiles of PCBs. Copper distribution on adjacent layers will be analyzed to determine its impact on heat dissipation. Additionally power losses of integrated circuits will be modeled to simulate the full-board thermal behavior under realistic operating conditions.
The electrical simulation will focus on comparing various designs. Harmonic loss calculations for PCB traces and vias will be performed to quantify their impact on electrical performance.
The expected outcomes include quantified thermal performance for different via configurations as well as reliability insights into solder fatigue and PCB material degradation if possible. The findings aim to provide design guidelines for enhancing thermal efficiency and long-term reliability in high-performance electronic systems.

Objectives
Compare temperature profiles across PCBs with no vias single thermal via and multiple thermal vias.
Investigate copper distribution on adjacent layers and its impact on heat dissipation.
Model power loss of ICs to simulate full-board thermal behavior under operational conditions.
Perform harmonic loss calculations for PCB traces and vias.

Tools
Ansys SIwave for signal integrity EMI/EMC and harmonic loss simulations.
Ansys Icepack for thermal modeling and heat flow analysis.
Ansys Sherlock for reliability and lifetime prediction including solder fatigue and PCB material stress.

What youll bring

You are a Masters student in Electrical Engineering Electronics and Mechatronics with a strong interest in power electronics and PCB design.
Solid theoretical understanding of electromagnetics thermal management and circuit design principles.
Experience or coursework in simulation tools such as Ansys Icepack SIwave Sherlock or similar is highly meritorious.
Basic knowledge of signal integrity (SI) power integrity (PI) and EMI/EMC concepts.
Strong analytical and problem-solving skills with attention to detail.
Ability to work independently while contributing effectively in a collaborative team environment.
Good communication skills in English both written and spoken.
A curious proactive and structured mindset with a passion for learning and innovation.

Duration

The work will start in January 2026
The duration for this thesis work is 20 weeks.
30 ECTS (Master academic credits) in agreement with your Thesis Advisor in University
This thesis is to be conducted by 2 Students working in pair.