We are looking for a senior level SoC packaging engineer to develop exciting new products. Your role is to interface between internal product/device design quality supply chain and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
- M.S or Ph.D. degree in mechanical engineering physics materials science or similar disciplines with a minimum of 5 years of experience in IC packaging.
- In-depth knowledge in large body size MCM package technologies inclusive of SoC & HBM integration RDL & Silicon with deep trench capacitor interposer and Chip-on-Wafer processes.
- Good understanding to organic package process & material characterization such as micro bump plating RDL lithography molding compound and under-fill. Knowledge in HBM integration and reliability characterization advanced silicon node BEOL and device physics or component/board level reliability testing are plus.
- Proven track record to drive issue resolution with good understanding to root cause and physics motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
- Good written and verbal communication skills. Able to present ideas design concepts data and plan with high confidence at internal or external meetings.
We are looking for a senior level SoC packaging engineer to develop exciting new products. Your role is to interface between internal product/device design quality supply chain and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very in...
We are looking for a senior level SoC packaging engineer to develop exciting new products. Your role is to interface between internal product/device design quality supply chain and the external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.
- M.S or Ph.D. degree in mechanical engineering physics materials science or similar disciplines with a minimum of 5 years of experience in IC packaging.
- In-depth knowledge in large body size MCM package technologies inclusive of SoC & HBM integration RDL & Silicon with deep trench capacitor interposer and Chip-on-Wafer processes.
- Good understanding to organic package process & material characterization such as micro bump plating RDL lithography molding compound and under-fill. Knowledge in HBM integration and reliability characterization advanced silicon node BEOL and device physics or component/board level reliability testing are plus.
- Proven track record to drive issue resolution with good understanding to root cause and physics motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
- Good written and verbal communication skills. Able to present ideas design concepts data and plan with high confidence at internal or external meetings.
View more
View less