(Sr.) Technical Director – Advanced Packaging
(Sr.) Technical Director – Advanced Packaging
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Job Description
Who We Are
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.
What We Offer
Location:
HsinchuTWNYoull benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.
At Applied Materials we care about the health and wellbeing of our employees. Were committed to providing programs and support that encourage personal and professional growth and care for you at work at home or wherever you may go. Learn more about our benefits.
Position Summary
Applied Materials is seeking a seasoned and visionary (Sr.) Technical Director to lead R&D efforts within our Advanced Packaging Technology Team. This role will drive the development and optimization of next-generation packaging technologies serving as the technical interface to TSMCs Advanced Packaging team across both development and high-volume manufacturing sites. As part of one of the fastest-growing divisions at Applied Materials this position offers high visibility direct engagement with senior leadership and significant growth potential. You will lead multiple high-impact R&D projectsfrom early-stage evaluations and first-in-fab demos to strategic technology roadmap planningwhile collaborating closely with internal business units and customer stakeholders.
Key Responsibilities
- Lead the development optimization and deployment of advanced packaging technologies.
- Act as the primary technical liaison to TSMCs Advanced Packaging team supporting both tactical and strategic initiatives.
- Drive customer engagement through demos early learning systems evaluations and first-in-fab projects.
- Run reqular technical review meeting (TRM) be the technical voice of customer (VoC) positively influencing product developing roadmap at early design phases .
- Collaborate with senior customer stakeholders to align roadmap solve integration complex process challenges improving yield productivity and cost efficiency .
- Deliver clear data-driven technical reports and recommendations to internal teams and external partners.
- Build and mentor a high-performing technical team fostering innovation and cross-functional collaboration.
- Contribute to long-term technology roadmaps and strategic planning for advanced packaging solutions.
- Introduce and implement new analytical methodologies to improve process control and standardization.
- Promote knowledge sharing and best practices across business units and product lines.
Qualifications
- Masters or Ph.D. degree in Materials Science Chemical Engineering or Electrical Engineering.
- 15 years of experience in the semiconductor industry with a strong focus on advanced packaging R&D.
- Proven track record in new product introduction (NPI) and cross-functional technical program leadership
- Demonstrated success in technical project management and customer engagement particularly in development-stage technologies.
- Strong leadership and team management capabilities with the ability to mentor and grow high-performing technical teams.
- Excellent communication skills in English; Mandarin proficiency is required.
- Willingness to travel domestically and internationally as needed.
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Additional Information
Time Type:
Full timeEmployee Type:
Assignee / RegularTravel:
Yes 20% of the TimeRelocation Eligible:
NoApplied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.
Required Experience:
Director
Employment Type
Full-Time
