3D Integration (Design for Test) engineer
Share
Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
Responsibility:
research on DFT (Design for Test) methodologies for digital logic chips focusing on defect mechanisms fault simulation and failure analysis.
DFT testing methodologies for 3DIC chips and conduct research on defect mechanisms fault simulation and failure analysis related to 3DIC and IO interconnects.
DFT testing approaches for Memory emerging NVM (Non-Volatile Memory) and analog IP with research experience in memory and analog defect mechanisms fault models and failure analysis.
for system-level end-to-end DFX (Design for Excellence) architecture and test implementation with in-depth understanding of chip lifecycle management concepts and methodologies.
Requirenment:
1. Technical Expertise Requirements
(1) Familiar with DFT technologies such as MBIST SCAN and ATPG as well as semiconductor manufacturing processes and device structures.
(2) Knowledge of digital and analog circuit failure mechanisms fault modeling and test algorithms.
(3) Research experience in digital circuit defect mechanisms fault simulation and failure analysis.
(4) Research experience in 3DIC and IO interconnect defects fault simulation and failure analysis.
(5) Research experience related to memory or analog circuit defect modeling simulation and failure analysis.
(6) Experience in system-level DFX implementation protection strategies and failure localization techniques.
2. Educational Requirements
(1) Masters degree or above
(2) Majors in Electronics Microelectronics Communications Automation Semiconductor Engineering Mathematics Physics Chemistry or related fields.
3. Work Experience
510 years of relevant experience.
Key Skills
- APIs
- Jenkins
- REST
- Python
- SOAP
- Systems Engineering
- Service-Oriented Architecture
- Java
- XML
- JSON
- Scripting
- Sftp
About Company
ABOUT HUAWEI Huawei is a leading telecom solutions provider. Through continuous customer-centric innovation, Huawei has established end-to-end advantages in Telecom Network Infrastructure, Application & Software, Professional Services and Devices. With comprehensive strengths in wirel ... View more
