Process Development Engineer (R&D)
Process Development Engineer (R&D)
Posted on :
28-09-2025
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1 Vacancy
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Job Description
- Work on process equipment to conduct proof of concept evaluation and DOEs - Establishment of baseline process and metrics- Perform process characterization- Establish design guidelines for manufacturability- Define procedures and metrologies- Generate engineering report base on studies and evaluation- Reporting of engineering studies to cross-functional team
- Degree of Science in Engineering or equivalent
- Minimum 2 to3 years of experience in doing process R&D
- Hands-on experience in various module assembly processes such as flip chip flex attach pick and place dispensing wire bonding filling laser soldering component cleaning curing plating singulation wafer bonding.
- Good knowledge in design of experiment (DOE) engineering statistic root cause analysis and problem solving
- Familiarity on different metrology tools and quantitative measurement methodology
- Clear and effective written and communication skill
- Resourceful and innovative
- Knowledge and work experience in one or more of the following processes & handling such processes equipment - 1) Flip Chip bonding (Thermosonic Thermocompression and etc) OR 2) EVO die bonder or any Pick & Place equipment platform OR 3) Wirebond/Studbump) OR 4) Flex Attach (Flexible Printed Circuit Board Bonding) Solder Jetting/Laser Wire Soldering OR 5) SMT (e.g. solder printing component pick&place AOI SPI and reflow)
- Knowledge on adhesive or epoxy or other bonding material is an advantage
- Experience in optical components active alignment and high accuracy bonding process is preferred
Employment Type
Full Time
Key Skills
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