Thermal and Mechanical Modeling & Simulation engineer
Share
Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
Responsibility:
thermal and thermal-stress coupled modeling and simulation in IC design including but not limited to thermal conduction thermal expansion thermo-mechanical coupling electro-thermal coupling and electromagnetic coupling and more multiphysics analysis.
numerical simulation methods for thermal and stress analysis optimize design and resolve potential thermal management issues.
thermal and stress modeling with commercial simulation tools to ensure performance and reliability requirements are met; lead the optimization and iteration of in-house thermal simulation tools; edit and optimize numerical equations to improve simulation accuracy and efficiency.
closely with cross-functional teams providing technical support in thermal and stress modeling to ensure successful implementation of design solutions.
improve modeling methodologies and simulation workflows to enhance overall R&D efficiency.
Requirenment:
- Experience of novel heatsink design (eg. lid or coldplate with microchannels) including the microchannel topology and interface design simulation and optimization
- Strong foundation in mathematics physics and thermodynamics especially in heat conduction thermal-stress coupling analysis and materials science.
- Familiarity with thermal transportation thermal-mechanical coupling and CFD-based modeling methods and proficiency in numerical simulation techniques (e.g. finite element or finite volume analysis).
- Proficient in using mainstream simulation software.
- Relevant experience in semiconductor with the ability to understand and address thermal stress issues in semiconductor.
- Familiarity with programming languages such as Python and C with the capability to independently develop scripts or implement data-driven modeling workflows.
- Experience in applying AI / machine learning techniques (e.g. surrogate modeling model order reduction design optimization or automated parameter tuning) to enhance simulation accuracy or efficiency is highly preferred.
- Prior work experience in semiconductor is preferred.
Educational Requirements
Masters degree or above in Electrical Engineering Physics Mechanical Engineering or related fields (PhD. or equivalent degree).
Work Experience
PHD 0 - 2 years
Msc 3 - 5 years
Key Skills
- Mechanical Design
- System Design
- FEA
- ASME Codes & Standards
- CAD
- Mechanical Knowledge
- Creo
- SolidWorks
- Mechanical Engineering
- Autocad
- HVAC Design
- Autodesk Inventor
About Company
ABOUT HUAWEI Huawei is a leading telecom solutions provider. Through continuous customer-centric innovation, Huawei has established end-to-end advantages in Telecom Network Infrastructure, Application & Software, Professional Services and Devices. With comprehensive strengths in wirel ... View more
