NPI Process Engineer
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Job Location:
Kuala Lumpur - Malaysia
Monthly Salary:
Not Disclosed
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
Responsible for supporting New Package development of processes in automotive applications.
Responsible for quality yield cost and process improvement activities.
Responsible for process documentation process spec standard work instruction OCAP Lead etc.
Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.
Take ownership to work closely with upper management to align scope and direction of key projects.
Qualification
Candidate must possess at least a Bachelors Degree in Engineering (Material Science/Electrical/Mechanical or equivalent).
1-2 years of work experience with semiconductor assembly background for automotive customers.
Experience in MAPBGA SiP FCCSP FCBGA etc. packing development will be an added advantage.
Good technical knowledge and hands-on experience in semiconductor manufacturing processes such as saw die bond wire bonding mold ball attach marking singulation etc.
Candidate must have great interpersonal skills leadership skills positive minded self-driven and eager to strive for success.
Good SPC Process Control and other relevant statistical & problem-solving skills
Good in Microsoft application (PowerPoint Excel Macro Word etc.). Project management knowledge is an added advantage.
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Key Skills
- Lean Manufacturing
- Six Sigma
- Distributed Control Systems
- Continuous Improvement
- Process Improvement
- Minitab
- Root cause Analysis
- Process Engineering
- cGMP
- Kaizen
- Programmable Logic Controllers
- Manufacturing
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.
