Senior Principal Thermal Engineer

Description

As a Senior Principal Thermal Engineer you will focus on the alignment of OCI thermal hardware design with specific experience in Rack Cooling and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical Electrical Thermal and Software) to develop and set cooling strategies and actual HW setup that are optimized for the entire rack and effectively manage high performance data center infrastructure. You will work with internal and external partners focusing on delivering the next generation of world class fluid-cooled hardware and data centers.

• Build conduct thermal simulations and review thermal simulation models from partners to identify data center risks and improve efficiency.
• Familiarization with Open Compute Design Specifications.
• Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs.
• Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts
• Experience with mechanical validation tests process that may include Environmental Test Engineering (ETE) Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus
• Experience in negotiating establishing and managing relationships with vendors

Career Level - IC5

Requirements & Responsibilities

• Collaborate with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services.
• Lead thermal design reviews and presentations of concepts topeers partner teams and executives.
• Proficient with thermal modeling tools at componentserverrack and data center levels
• Engineering analysis of fluid cooling assembly and fit-up engineering verification of various GPU and switch configurations in respective racks
• Experience with sourcing and selection of in-row and in-rack CDUs for high end / high reliability compute solutions.
• Lead liquid cooling server/ rack designs to support engineering lab and manufacturing tests
• Aware of latest fluid cooling industry road map and key technology driving factors for deploying different fluid cooling technologies
• Experience in design and delivery of direct to chip liquid cooling loops including internal manifolds cold plates hoses and QDs for high end high reliability compute systems
• Establish a good working relationship with outside suppliers to develop high quality components (e.g. heat-sinks etc.) and manage thermal/liquid cooling vendor selection process
• Oversee the build and validation test process of prototypes
• Perform root cause and corrective action analysis as required
• Interface with internal and external customers to meet product design intent
• Familiar with fluid cooling end assembly (L10/L11) manufacturing challenges and long-term reliability concerns
• Work jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes.
• Engage hardware development organizations to drive concepts to the product roadmap and OCI data center fleet.
• Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications.
• Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems.
• Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure.
• Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests. Analyze results to validate compliance with platform and data center infrastructure specifications.
• Support the high-level thermal design direction and data center strategy for complex systems ranging from advanced computing (HPC GPU FPGA Accelerators etc.) to general purpose compute storagenetworkand/or other specialized programs.
• Create robust scalable secure and extensible thermal architecture solutions that account for current and anticipated industry/competitive needs.
• Distill and articulate architectural tradeoffs in the thermal space in terms of key metrics such as feasibility performance cost reliabilityavailabilityand schedule.
• Partner with the platform and data center architects to drive OCI roadmap definitions.
• Look for opportunities to generate intellectual property to help strengthen OCIs position as a leader in cloud computing.
• Drive and influence technology providers and design partners to develop optimal components and solutions to meet the future requirements of the OCI fleet.
• Partner within the industry and standards bodies to create standards and form factors key to next generation solutions.
• Collaborate with the hardware development and data center design and construction teams to ensure seamless transition from architecture to implementation.

Minimum Qualifications

10 years cloud scale provider OR related technical engineering experience ANDa Bachelors Degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.

o OR 7 years related cloud scale provider OR technical engineering experience ANDMasters Degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.

o OR 5 years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical Thermal Fluid Science Systems or Aerospace Engineering.

Experienceand proficiency in Computational Fluid Dynamics (CFD) analysis and Model Based Design (MBD) analysis.

Expertise using Cadence Data Center Solution (aka 6SigmaDCX) ORCoolSim ORTileFlow ORAutoDeskCFD OR ANSYS -Icepak OR Mentor GraphicsFloTHERM.

Expertise using MATLAB & Simulink OpenModelica Dymola

Qualifications
Disclaimer:

Certain US customer or client-facing roles may be required to comply with applicable requirements such as immunization and occupational health mandates.

Range and benefit information provided in this posting are specific to the stated locations only

US: Hiring Range in USD from: $120100 to $251600 per annum. May be eligible for bonus equity and compensation deferral.

Oracle maintains broad salary ranges for its roles in order to account for variations in knowledge skills experience market conditions and locations as well as reflect Oracles differing products industries and lines of business.
Candidates are typically placed into the range based on the preceding factors as well as internal peer equity.

Oracle US offers a comprehensive benefits package which includes the following:
1. Medical dental and vision insurance including expert medical opinion
2. Short term disability and long term disability
3. Life insurance and AD&D
4. Supplemental life insurance (Employee/Spouse/Child)
5. Health care and dependent care Flexible Spending Accounts
6. Pre-tax commuter and parking benefits
7. 401(k) Savings and Investment Plan with company match
8. Paid time off: Flexible Vacation is provided to all eligible employees assigned to a salaried (non-overtime eligible) position. Accrued Vacation is provided to all other employees eligible for vacation benefits. For employees working at least 35 hours per week the vacation accrual rate is 13 days annually for the first three years of employment and 18 days annually for subsequent years of employment. Vacation accrual is prorated for employees working between 20 and 34 hours per week. Employees working fewer than 20 hours per week are not eligible for vacation.
9. 11 paid holidays
10. Paid sick leave: 72 hours of paid sick leave upon date of hire. Refreshes each calendar year. Unused balance will carry over each year up to a maximum cap of 112 hours.
11. Paid parental leave
12. Adoption assistance
13. Employee Stock Purchase Plan
14. Financial planning and group legal
15. Voluntary benefits including auto homeowner and pet insurance

The role will generally accept applications for at least three calendar days from the posting date or as long as the job remains posted.

Career Level - IC5