Advanced Packaging Integration Engineer
Advanced Packaging Integration Engineer
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Job Description
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Department Intro:
The Technology Development (TD) department at Micron Technology is at the forefront of innovation driving the advancement of memory and storage solutions that transform how the world uses information. Our team is dedicated to developing cutting-edge processes and technologies that enable the creation of next-generation semiconductor products. By collaborating closely with our global R&D and manufacturing teams we ensure the seamless transfer and implementation of new technology nodes maintaining Microns leadership in the industry. Join us to be part of a dynamic and forward-thinking team that is shaping the future of technology.
Position Overview:
Join Microns Advanced Packaging Technology Development (APTD) team and be part of an innovative organization that drives strategic packaging initiatives critical to our future! As a Principal Advanced Packaging Integration Engineer you will work on brand-new solutions and collaborate with industry experts to propel our high-performance products to new heights.
Responsibilities:
- Develop and transfer technology in collaboration with process and design teams
- Design and tape out reticles develop process flows and secure resources including wafers and processes
- Collect and analyze data to provide actionable outcomes for layout design or integration flow changes
- Achieve and improve yields impacted by design limitations working with Probe Yield Analysis Test and Reliability Engineering teams
- Ensure critical work achievements and goals are met while guiding resource utilization
Minimum Qualifications:
- MS in Electrical Mechanical Computer Engineering Chemistry Physics Materials or related field
- 10 years of experience in Process Integration/Development or Package Integration within the semiconductor industry
- Strong architectural sense to translate process/design into technical requirements and specifications
- 10 years expertise in data extraction analysis and reporting tools such as JMP Python R
- In-depth understanding of process flows interactions and their effects on yield performance and reliability
- Technical knowledge and experience in Ultra-Thin Die Integration Thermal Compression Bonding Die to wafer and Gap fill technology in a semiconductor environment
- Experience in various assembly processes like Dicing Thinning Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures
Preferred Qualifications:
- Ph.D. or equivalent experience in Electrical Mechanical Computer Engineering Chemistry Physics Materials or related field
- Experience with DRAM HBM NAND 3D interconnects or packaging technologies
- Proven leadership in a mentorship capacity
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.
To request assistance with the application process and/or for reasonable accommodationsplease contact
Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Employment Type
Full-Time
