Packaging Substrate Engineer

Apple

Posted on : 21-08-2025

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1 Vacancy

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Job Location

Santa Clara - USA

Monthly Salary

Not Disclosed

Salary Not Disclosed

Vacancy

1 Vacancy

Posted on : 21-08-2025

Job Description

-Lead SoC package substrate development pathfinding technology and roadmap definition. -Work with substrate manufacturing industry foundry and OSAT to bring package substrate solution from concept to HVM.-Work across a variety of cross-functional groups directly and involve themselves in engineering and product development.-Drive industry with sophisticated package solutions new material development and specs. - 5% International travel.

BS and 3 years of relevant industry experience.

MS or Ph.D. and 2 years of relevant industry experience.
Proven fundamentals in the material/chemistry/ or mechanical engineering field(s).
In-depth knowledge of substrate technology manufacturing process design rules and roadmap.
Hands-on experience in substrate manufacturing and technology development: Cu plating Lithography Dielectric material Laser via formation and Solder resist.
Familiar with package assembly and integration process preferred.
Experience in Cadence Allegro platform tools and design review for manufacturing (DFM).
Exceptional technology development & project management skills.
Strong communication & collaborative skills.

Employment Type

Full Time

Company Industry

Key Skills

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About Company

Apple

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Packaging Substrate Engineer

Apple

Job Description

Employment Type

Company Industry

Key Skills

About Company

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