The position is on Apples innovative Mac Reliability Engineering team where we collaborate with hardware development and Silicon packaging. The engineer will be responsible for leading board level reliability on new Mac portables development of new test procedures to quantify the reliability of a design and failure analysis resulting from these tests.
MS in Materials Science Electrical Mechanical Engineering or an equivalent field desired
Ability to use fundamental failure analysis methodology to derive root cause of failures knowledge of failure modes and statistical life data analysis using curve fitting and distributions models
Knowledge of board level design DFM (Design for Manufacturing) and reliability best practices to guide component selection and placement in early architecture
Knowledge of Semiconductor package integration SLI (Second Level Interconnect) reliability passive components reliability bonding materials and warpage control
Application of FMEA (Failure Modes an Effects Analysis)
Ability to travel internationally without restrictions
PhD in Materials Science Electrical Mechanical Engineering or an equivalent field desired
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