Sr. Principal Engineer
Sr. Principal Engineer
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Not Disclosed
Salary Not Disclosed
1 Vacancy
Job Description
Primary Duties & Responsibilities
Technology Leadership
- Architect and lead R&D projects involving VCSEL-based and SiPh interconnect technologies with applications in 800G/1.6T transceivers and beyond.
- Develop novel CPO architectures for high-density AI/ML workloads focusing on reducing power latency and system complexity.
- Drive the convergence of datacom and AI by co-designing photonics and electronic platforms tailored to edge inference and training clusters.
AI-System Co-Design
- Collaborate with AI hardware teams to define interconnect requirements for AI accelerators (GPUs/NPUs).
- Develop and evaluate low-latency high-throughput optical links for real-time AI inference especially for edge and hybrid cloud environments.
- Leverage ML techniques (e.g. reinforcement learning neural architecture search) for hardware/system optimization.
Photonic Device & Packaging Innovation
- Lead the integration of VCSELs SiPh modulators and photonic packaging into scalable system architectures.
- Investigate next-gen materials and packaging for improved thermal management and photonic-electronic co-integration.
- Guide reliability assessments and DfX strategies to ensure manufacturability at scale.
Collaboration & Mentorship
- Partner with cross-functional teams: signal integrity firmware AI system architects and manufacturing.
- Mentor junior engineers and guide cross-disciplinary research initiatives.
- Contribute to technology standardization and IP development (publications patents consortium involvement).
Education & Experience
- Ph.D. or M.S. in Electrical Engineering Photonics Computer Engineering or related discipline.
- 5 years of hands-on experience in datacom photonics with a strong background in VCSELs SiPh or integrated optics.
Skills
- Leadership capabilities to xxxx
- Strong interpersonal teaming and problem-solving skills.
- Work effectively with other members of II-VI A&D xxxxx.
Working Conditions
- Expertise in CPO system design including mechanical thermal and optical interface co-optimization.
- Proven experience in AI hardware or co-design of interconnects for AI compute workloads.
- Familiarity with relevant standards (IEEE 802.3 OIF COBO) and simulation tools (Lumerical HFSS COMSOL etc
Physical Requirements
- Onsite / hybrid work required
Safety Requirements
All employees are required to follow the site EHS procedures and Coherent Corp. Corporate EHS standards.
Quality and Environmental Responsibilities
Depending on location this position may be responsible for the execution and maintenance of the ISO 9000 and/or other applicable standards that may apply to the relevant roles and responsibilities within the Quality Management System and Environmental Management System.
CultureCommitment
Ensure adherence to companys values (ICARE) in all aspects of your position at Coherent Corp.:
Integrity Create an Environment of Trust
Collaboration Innovate Through the Sharing of Ideas
Accountability Own the Process and the Outcome
Respect Recognize the Value in Everyone
Enthusiasm Find a Sense of Purpose in Work
Coherent Corp. is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex gender identity sexual orientation race color religion national origin disability protected Veteran status age or any other characteristic protected by law.
To conform to U.S. Government export regulations (ITAR) applicant must be a U.S. citizen lawful permanent resident of the U.S. protected individual as defined by 8. U.S.C. 1324b(a)(3) or eligible to obtain the required authorizations from the U.S. Department of State.
Required Experience:
Staff IC
Employment Type
Full-Time
