3D NAND TD CMOS Device Engineer
3D NAND TD CMOS Device Engineer
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1 Vacancy
Job Description
As a 3D NAND TD CMOS Device Engineer you will be responsible for designing developing and characterizing CMOS transistors for 3D NAND flash memory technology at Solidigm.
Key Responsibilities:
- Device design: developing next generation CMOS transistors to achieve desired performance power and ariel density target for 3D NAND chip including I/O analog and high-voltage device types.
- Electrical characterization: designing test chip & scribe structures performing electrical measurements to validate device design target and identify improvement directions.
- Process development: together with fabrication team designing new transistor DOE developing and optimizing fabrication process. Identifying critical process parameters and yield limiters ensuring consistent transistor performance in production.
- Data analysis: utilizing statistical data analysis software to analyze complex data sets including inline and electrical to identify trends diagnose issues and improve device margin by iterations.
- Cross-functional collaboration: working closely with Design Reliability and PE to solve CMOS related issues ensuring NAND die and component meeting performance target and passing reliability qualification.
- Technology scaling: staying updated with advanced CMOS technology evolution and disruptive innovations in device architecture materials and fabrication technologies. Staying updated with industry and competitor CMOS roadmap and influence future CMOS technology roadmap for Solidigm.
Qualifications :
Required:
- BS MS or PhD in a science or engineering field and minimum 5 years of experience in research or development environment for the relevant technical areas are required
- Strong understanding of semiconductor physics particularly CMOS transistor operation and device scaling principles.
- Excellent statistical data analysis and problem-solving skills
- Strong communication and collaboration skills to work effectively with cross-functional teams. The candidate will need to be a collaboration role model establishing strong technical and personal credibility ensuring on-time project success through influencing and working with other organizations
- Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking
Preferred:
- Hands-on expertise in electrical characterization techniques like IV curves capacitance-voltage measurements and device modeling.
- Experience with semiconductor fabrication processes
Working Conditions: This position is primarily office-based. Some international travel is expected.
Additional Information :
The compensation range for this role is $136750 - $252010. Actual compensation is influenced by a variety of factors including but not limited to skills experience qualifications and geographic location.
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Remote Work :
No
Employment Type :
Full-time
Employment Type
Full-time
