Field Application Engineer
Field Application Engineer
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Salary Not Disclosed
1 Vacancy
Job Description
Our client is a world-class electronic circuit solution provider with over 35 years of history and global operations. As a trusted partner to leading communications automotive and medical equipment brands they continues to drive innovation in PCB and advanced packaging substrate technology. To support our expansion in the U.S. market we are looking to onboard a Field Application Engineer with deep knowledge of packaging substrates to work remotely from California.
Location: Remote (must be based near or in California)
Employment Type: Full-time
Industry: Semiconductor / PCB / Packaging Substrate
Languages: English
Compensation: $100000$150000/year (based on experience)
Responsibilities:
Research and identify customer development opportunities across the United States
Serve as the technical point of contact for customers supporting product demand analysis and technical communication
Analyze industry trends product evolution and customer feedback to guide development strategies
Collect and interpret competitor intelligence to benchmark and position our offerings effectively
Support the planning and participation in relevant trade shows and product exhibitions in the U.S.
Build and expand customer acquisition channels to boost U.S. market penetration
Requirements:
5 years of experience in the packaging substrate industry with background in process engineering product development or technical support
Hands-on knowledge of customer engagement and technical requirement management in advanced PCB or packaging substrate companies
Must be based in the United States with permanent residency or equivalent legal work status
Proactive self-driven and confident in handling external communication with U.S. clients
Strong interpersonal skills with the ability to interface effectively with R&D and sales teams in China
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Employment Type
Full Time
