Design for Manufacturing (DFM) Engineer - PCBA
Design for Manufacturing (DFM) Engineer - PCBA
Posted on :
02-08-2025
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1 Vacancy
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Job Description
- In this highly visible role you will have the opportunity to make a significant impact on Apple Products and leave a footprint for years to come. We have an opportunity for an accomplished PCBA DFM engineer to lead the development and ramp for a next generation Apple product.- Our PCBA DFM engineering team enables the mass creation of impossible products as a partner in the development of Apples renowned designs.- Key responsibilities will include:- Attend development builds as required under direction of Operations Engineering Directly Responsible Individual (DRI). - May provide guidance and resources to contract manufacturing (CM) partner engineers.- Acts as project leader on a variety of complex projects.- Plans develops and implements technically complex procedures for PCBA manufacturing process rework and testing. - Make recommendations for changes required in testing equipment (ICT and Functional test) manufacturing processes and new testing requirements.- Designs and develops technically complex new processes to improve quality and efficiency.- Provides early manufacturing involvement to ensure new products are manufacturable. Activities include driving out costs in design/PCBA manufacturing tooling influencing designs so that they are manufacturable reducing complexity by using standard size packaging.- Interface with Apple Printed Circuit Board Assembly (PCBA) Subcontractor and manage technical aspects of Volume Manufacturing builds including rework processes with direction as necessary from Operations Engineering DRI. - Ensure Apple PCBA Subcontractors/JDM partner adherence to Process Parameters and Procedures as well as approved Manufacturing and Test processes. Ensure maintenance of specified quality levels at PCBA Manufacturing sites- Travel domestically and internationally to supplier sites 30%
- BS/MS in Mechanical Electrical Industrial Chemical or Manufacturing Engineering with 5 to 6 years experience working in Printed circuit board assembly or with surface mount technology at a contract manufacturer or any related experience.
- 5 years of experience in printed circuit assembly manufacturing processes.
- Surface mount technology process knowledge including stencil printing pick and placement process reflow process hotbar robotic/laser soldering and ACF process.
- Experience developing process quality plans supplier quality audits and driving corrective actions and failure analysis efforts.
- Working knowledge of printed circuit board assembly (PCBA) reliability concepts failure analysis techniques like EDX SEM and FTIR.
- Experience with the development and evaluation of various SMT processes
- Project management experience and a deep understanding of problem solving tools including design of experiments root cause analysis and statistical analytical tools
- Experience with any of the following: packaging technology chip scale or wafer level chip scale packaging technology molding process System in package construction
- Effective communication skills with an ability to explain complex problems to a wide variety of technical and non-technical audiences
- Good team player with an ability to work with multiple x-functional teams
Employment Type
Full Time
Key Skills
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