Principal Embedded Software Engineer
Principal Embedded Software Engineer
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Job Description
Cohesive Technologies is a global IT Services & Solutions company providing IT Staffing Services and Application Development Services necessary for technology leaders to deliver business value. We help our people and clients succeed by leveraging our expertise deep industry and market knowledge proprietary assessment tools and techniques and project delivery methodologies. Through relationships with thousands of specialized professionals we bring an unparalleled ability to match talent with opportunities by assessing recruiting developing and engaging the best and brightest people for our clients. We combine broad geographic presence world-class solutions and a tailored consultative approach to help our people and clients achieve higher performance and outstanding results.
Role: Principal Embedded Software Engineer
Location: Redmond WA
Position Type: Full Time
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Principal Embedded Software Engineer to join our team focusing on the bring-up and optimization of Qualcomm chipsets for cutting-edge devices. In this role you will be instrumental in the initial bring-up phases driving Board Support Package (BSP) development and ensuring robust platform functionality. You will leverage your deep technical expertise to work with the latest Qualcomm technologies including the Qualcomm 8650 platform to deliver high-performance and reliable solutions.
Responsibilities:
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Lead the bring-up of new Qualcomm chipsets on custom hardware from initial power-on to full system functionality.
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Drive Board Support Package (BSP) development including bootloaders kernel modifications and device drivers specifically targeting Qualcomm platforms.
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Debug complex low-level issues spanning hardware firmware and software layers during the chipset bring-up process.
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Collaborate closely with hardware design teams silicon vendors (Qualcomm) and software development teams to resolve integration challenges.
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Optimize system performance power consumption and stability for Qualcomm-based platforms.
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Develop and maintain robust validation and diagnostic tools for chipset and BSP verification.
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Contribute to architectural discussions and provide technical leadership for embedded software initiatives.
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Document technical designs specifications and troubleshooting guides for internal and external teams.
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Direct experience with Qualcomm 8650 (Snapdragon 8 Gen 2/3 series) or similar high-performance Qualcomm mobile/compute chipsets.
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Experience with bootloaders (e.g. U-Boot LK) trusted execution environments (TEEs) and secure boot processes.
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Familiarity with hardware schematics and datasheets.
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Experience in power management and performance optimization for embedded systems.
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Knowledge of mobile communication technologies (e.g. 5G Wi-Fi Bluetooth) and their integration at the chipset level.
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Masters degree in Electrical Engineering Computer Science or a related field.
Cohesive Technologies is an equal access/equal opportunity employer and does not discriminate on the basis of age color disability marital status national origin race religion sex sexual orientation veteran status or any other classification prescribed by applicable law.
Employment Type
Full-time
