Advanced Package Signal and Power Integrity Principal Engineer
Advanced Package Signal and Power Integrity Principal Engineer
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Job Description
About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI automotive and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
Your Team Your Impact
The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical mechanical thermal and system requirements for the next generation high performance computing (HPC) Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity power integrity thermal integrity mechanical integrity processability manufacturability and reliability involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multichip multiple component configurations involving but not limited to 2.5D and 3D packages Copackaged copper or optics and advanced substrates. Marvell has partnered with the worlds leading manufacturers to solve our customers most challenging designs and integrations with industryleading packaging technologies.What You Can Expect
- Create new package technology concepts perform routing feasibility signal and power integrity studies for design optimization.
- Work with stakeholders to define and validate advanced design rule roadmap for interposer substrates and packages.
- Explore technologies beyond what is currently available make recommendations and create and protect IP to maximize performance.
- Explore technology feasibility and create proofofconcept samples.
What Were Looking For
Deep knowledge of Electrical Engineering concepts circuit extractions and simulation as well as design methodology and strategies.
Experience in signal and power integrity simulations analysis and optimization for 2.5D and 3D packages including interface with memory interposer substrates and PCBs.
Ability to determine optimal signal routing power delivery verification and package size determination
Experience interfacing with product design teams for optimized floorplanning package related design input and power delivery network design.
Bachelors degree in electrical engineering or related fields and 15 years of related professional experience in signal and power integrity or masters degree and 12 years of related professional experience or PhD degree with 8 years of experience
Skills needed to be successful in this role:
- Deep understanding of fundamental concepts of signal and power integrity transmission line and electromigration and the ability to apply those concepts to create new design rules and explore new package technologies.
Mastery in tools and workflows: signal and power integrity analyses using Cadence Sigrity PowerSI and Ansys SIwave; EM sims using Ansys HFSS SIWave Cadence Clarity and the ability to correlate that with real world challenges.
Good understanding of interposer substrate package PCB level design rules ability to perform routing feasibility studies using Cadence APD or PCB editor.
Understanding of signal and power integrity for 2.5D/3D packages including (a) CoWoSS/R/L (b) EMIB (c) CPO (d) CPC
Ability to manage programs involving crossfunctional teams. Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
Ability to influence vendors to align their roadmap with company goals.
Strong communication presentation and documentation skills
The ideal candidate would have:
- Experience with VNA and TDR measurements for package and PCB characterization
- Experience in advanced package and substrate technologies with understanding of process and materials component and board level reliability warpage and thermal management.
- Board and system level signal and power integrity analysis
- Experience with programming languages: Python Perl Skill C
Expected Base Pay Range (USD)
$ per annumThe successful candidates starting base pay will be determined based on jobrelated skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
At Marvell we offer a total compensation package with a base bonus and and financial wellbeing are part of the package. That means flexible time off 401k plus a yearend shutdown floating holidays paid time off to volunteer. Have a question about our benefits packages health or financial Ask your recruiter during the interview process.All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .
#LIMM1Required Experience:
Staff IC
Employment Type
Full Time
