Director of Advance Packaging Silicon Integrator
Director of Advance Packaging Silicon Integrator
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$ 141500 - 341500
1 Vacancy
Job Description
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.
As a Package Silicon Integrator in Package Development Engineering (PDE) you willleadand drive MicronsPackagingTechnology Development Projects meeting Time to Market (TTM) business unit needs as well as meeting performance targets for Thermal Electrical Mechanical Reliability and Cost. Youwill collaborate withMicrons cross functional team that include Product Development Wafer level process Assembly Test Manufacturing and Global Quality. Together we will be responsible for thedesigning Test Vehicle Development Strategy and to definition development and deliveryof stateoftheartproduct/packages thatwillshapethefutureof advancedcomputing automotive and mobile products.
Responsibilities will include but are not limited to:
- Drive package technology integration activities for the silicon test chip development projects and support NPIs to keep roadmap items on track to meet go to market timelines.
- Coordinate core team in Development and NPI space of advanced 2.5D/3D packages and standard packaging to drive material and BOM choices body sizes manufacturability and package constructions to achieve acceptable Design for Manufacturing (DFM) and Design for Reliability (DFR) requirements.
- Evaluate wafer design inclusive of bondpad scribe pillars/bump and polyimide and drive materials and BOM choices such as die thickness and mold compound to meet chip package interaction requirements.
- Drive materials characterization from both package and die components to understand chip package interaction mechanism using TMA DMA nanoindentation and packaging mechanical and thermal stress stimulus.
- Drive novel solutions with silicon design and product teams to recommend the optimum package solutions to meet electrical mechanical 1st 2nd and 3rd level interconnect) Thermal Reliability Cost and other System level requirements.
- Interface closely with cross functional team that include Product Development Wafer Level Process Assembly Test Manufacturing and Global Quality and manage the product/package to mass production.
Successful candidates for this position will have:
- Appreciation for Structured Problem Solving
- Ability to interpret die package and systemlevel design and simulation (thermal/mechanical/electrical) methodologies and results.
- Knowledge in Chip Package Interaction (CPI)
- Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO SoIC CoWoS WoW InFO and other chiplet/SiP architectures.
- Experience with wafer bumping package assembly substrate technology BOM selection testing and product development lifecycle.
- Excellent communication skills with the ability to convey complex technical concepts to both technical and nontechnical stakeholders.
- Demonstrated leadership experience in guiding crossfunctional teams and driving technical excellence.
Required Experience:
- Bachelor/Master of Science in physics materials mechanical chemical or electrical engineering. MS or PhD preferred
- 10 years of relevant experience in semiconductor manufacturing or a related field with handson experience in semiconductor packaging or Frontend processes
The US base salary range that Micron Technology estimates it could pay for this fulltime position is:
$141500.00 $341500.00Our salary ranges are determined by role level and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range individual pay is determined by work location and additional jobrelated factors including knowledge skills experience tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits discretionary bonuses and equity.
As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid timeoff program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.
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To learn more about Micron please visit Sites Only: To request assistance with the application process and/or for reasonable accommodations please contact Microns People Organization at or(select option #3
Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
Required Experience:
Director
Employment Type
Full-Time
