Sr IC Packaging Design Engineer Project Kuiper
Sr IC Packaging Design Engineer Project Kuiper
Posted on :
08-04-2025
Employer Active
1 Vacancy
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Yearly Salary
$ 143300 - 247600
Vacancy
1 Vacancy
Posted on :
08-04-2025
Job Description
Project Kuiper is an initiative to launch a constellation of Low Earth Orbit satellites that will provide lowlatency highspeed broadband connectivity to unserved and underserved communities around the world.
The Role:
As Senior IC Packaging Manufacturing and Reliability Engineer you will engage with an experienced crossdisciplinary staff to conceive and deliver innovative product IC package solutions. You will work closely with an internal interdisciplinary team and third party suppliers to drive key aspects of product definition and optimization. You must be responsive flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team you will be responsible for package definition manufacturing and reliability for mmwave beamforming SoCs and frontend modules. Strong focus will be on creating the most reliable lowest cost package for a given system use case.
In this role you will:
Drive IC packaging design and manufacturing from NPI to volume production
Drive production yield improvement through regular review of supplier key process parameters
Work with package vendors to define package architecture options BOM selection and design rule libraries
Generate packaging drawings and a set of standard package assembly operating procedures required at NPI and production stages
Engage material substrate and OSAT vendors to drive roadmaps and identify technology candidates to reduce cost and improve package performance
Define detailed package reliability test plans based on applicable acceleration models and expected usecase conditions
Define and drive package qualifications including MSL BHAST HTS TC and BLR
Troubleshoot package qualification and manufacturing issues drive root cause failure analysis and lead issues to resolution
Define key performance indicators and perform deepdive audits at vendor sites (assembly substrate raw materials) to downselect candidates and/or drive issue resolution
Analyze cost/performance tradeoffs for various package architectures including FCBGA FCCSP FOWLP WLCSP etc.
Collaborate with the antenna EE and mechanical teams to design and layout test vehicles and application PCBs for your packages
Export Control Requirement:
Due to applicable export control laws and regulations candidates must be a U.S. citizen or national U.S. permanent resident (i.e. current Green Card holder) or lawfully admitted into the U.S. as a refugee or granted asylum.
Bachelors degree in Engineering (Materials Chemical Mechanical) or other technical fields
7 years in manufacturing fullcustom packages for high performance chips
Proven track record of delivering complex IC packages from design through to volume production
Understanding of package material properties related to highvolume production and reliability: temperature cycling HAST shock vibration thermal resistance outgassing etc.
Experience with package qualification manufacturing and continuous improvement
Advanced degree in Engineering (Materials Chemical Mechanical) or other technical field
10 years in manufacturing fullcustom packages for high performance chips
Proven track record of supporting products through volume production
Strong understanding of package design roadmaps and manufacturing and experience onboarding new manufacturing partners (assembly substrate raw materials)
Experience delivering various package technologies including FCBGA FCCSP WLCSP FOWLP packages
Experience with working with OSAT suppliers and drove packaging issues to closure
Well versed in package qualification test methodology acceleration model definition and failure analysis
Strong written and verbal skills
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race national origin gender gender identity sexual orientation protected veteran status disability age or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $143300/year in our lowest geographic market up to $247600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on jobrelated knowledge skills and experience. Amazon is a total compensation company. Dependent on the position offered equity signon payments and other forms of compensation may be provided as part of a total compensation package in addition to a full range of medical financial and/or other benefits. For more information please visit This position will remain posted until filled. Applicants should apply via our internal or external career site.
The Role:
As Senior IC Packaging Manufacturing and Reliability Engineer you will engage with an experienced crossdisciplinary staff to conceive and deliver innovative product IC package solutions. You will work closely with an internal interdisciplinary team and third party suppliers to drive key aspects of product definition and optimization. You must be responsive flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team you will be responsible for package definition manufacturing and reliability for mmwave beamforming SoCs and frontend modules. Strong focus will be on creating the most reliable lowest cost package for a given system use case.
In this role you will:
Drive IC packaging design and manufacturing from NPI to volume production
Drive production yield improvement through regular review of supplier key process parameters
Work with package vendors to define package architecture options BOM selection and design rule libraries
Generate packaging drawings and a set of standard package assembly operating procedures required at NPI and production stages
Engage material substrate and OSAT vendors to drive roadmaps and identify technology candidates to reduce cost and improve package performance
Define detailed package reliability test plans based on applicable acceleration models and expected usecase conditions
Define and drive package qualifications including MSL BHAST HTS TC and BLR
Troubleshoot package qualification and manufacturing issues drive root cause failure analysis and lead issues to resolution
Define key performance indicators and perform deepdive audits at vendor sites (assembly substrate raw materials) to downselect candidates and/or drive issue resolution
Analyze cost/performance tradeoffs for various package architectures including FCBGA FCCSP FOWLP WLCSP etc.
Collaborate with the antenna EE and mechanical teams to design and layout test vehicles and application PCBs for your packages
Export Control Requirement:
Due to applicable export control laws and regulations candidates must be a U.S. citizen or national U.S. permanent resident (i.e. current Green Card holder) or lawfully admitted into the U.S. as a refugee or granted asylum.
Bachelors degree in Engineering (Materials Chemical Mechanical) or other technical fields
7 years in manufacturing fullcustom packages for high performance chips
Proven track record of delivering complex IC packages from design through to volume production
Understanding of package material properties related to highvolume production and reliability: temperature cycling HAST shock vibration thermal resistance outgassing etc.
Experience with package qualification manufacturing and continuous improvement
Advanced degree in Engineering (Materials Chemical Mechanical) or other technical field
10 years in manufacturing fullcustom packages for high performance chips
Proven track record of supporting products through volume production
Strong understanding of package design roadmaps and manufacturing and experience onboarding new manufacturing partners (assembly substrate raw materials)
Experience delivering various package technologies including FCBGA FCCSP WLCSP FOWLP packages
Experience with working with OSAT suppliers and drove packaging issues to closure
Well versed in package qualification test methodology acceleration model definition and failure analysis
Strong written and verbal skills
Amazon is committed to a diverse and inclusive workplace. Amazon is an equal opportunity employer and does not discriminate on the basis of race national origin gender gender identity sexual orientation protected veteran status disability age or other legally protected status.
Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees supervisors and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees supervisors and staff to ensure exceptional customer service; and follow all federal state and local laws and Company policies. Criminal history may have a direct adverse and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above as well as the abilities to adhere to company policies exercise sound judgment effectively manage stress and work safely and respectfully with others exhibit trustworthiness and professionalism and safeguard business operations and the Companys reputation. Pursuant to the Los Angeles County Fair Chance Ordinance we will consider for employment qualified applicants with arrest and conviction records.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process including support for the interview or onboarding process please visit for more information. If the country/region youre applying in isnt listed please contact your Recruiting Partner.
Our compensation reflects the cost of labor across several US geographic markets. The base pay for this position ranges from $143300/year in our lowest geographic market up to $247600/year in our highest geographic market. Pay is based on a number of factors including market location and may vary depending on jobrelated knowledge skills and experience. Amazon is a total compensation company. Dependent on the position offered equity signon payments and other forms of compensation may be provided as part of a total compensation package in addition to a full range of medical financial and/or other benefits. For more information please visit This position will remain posted until filled. Applicants should apply via our internal or external career site.
Required Experience:
Senior IC
Employment Type
Full-Time
Key Skills
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