Material Process Engineer 21492
Material Process Engineer 21492
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Job Description
Job Title: Material Process Engineer
Job Code:21492
Job Location: Palm Bay FL
Job Schedule: 9/80
Job Description:
The person filling this position will support crossfunctional team supporting the design and review of PrintedCircuitBoards designs prior to release to the board shop house. The ideal candidate will have extensive experience working in PCB fabrication shops with a strong focus on supporting the manufacturing of multilayer PCB boards. This role requires a deep understanding of PCB manufacturing processes materials and quality control measures. Should also have good understanding of complex HDI designs lamination and microvia structures. The role will require of some travel time as well auditing board shops that manufacture product that will be used within L3Harris products.
Essential Functions:
- Facility Process audit understand of HDI PCB manufacturing able to work with and support PCB suppliers in manufacturing and quality issues.
- Provides advanced technical support thru design phase and related to processes of manufacturing activities of the PCB.
- Troubleshoot and resolve manufacturing issues implementing corrective actions to improve yield and reduce defects.
- Identify criticaltoyield process parameters and specifications throughout the design review prior to drawing release and downstream manufacture.
- Understanding of Printed Circuit Board manufacturing and design applications.
- Candidate will support teams in the resolution of manufacturing production yields quality and reliability issues related to PCB matters.
- The engineer will work closely with a crossfunctional team to ensure hardware producibility and manufacturability build strategies.
- Attend participate and support design review meetings in detailed engineering design reviews as required.
Qualifications:
- Bachelors Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree minimum of 13 years of prior related experience.
Preferred Additional Skills:
- Working knowledge of IPC/JSTD workmanship requirements. Specifically IPCA600 IPC6012/6013 as well as MILSpec55110 and MILSpec31032.
- Deep knowledge of common PCB electronic packaging details including surface finishes plating lamination and stackup best practices.
- Experience on interconnect conductivity vs thickness and operating frequencies dielectrics choices.
- Knowledge on MicroVia Processes able to read microsections.
- PCB material finishes and type knowledge is required specifically prepreg core different material types.
- Understanding and knowledge of PCB manufacturing processes common defects problems and how those nonconformances impact overall reliability of the product.
- Knowledge of bare PCB manufactures capabilities constraints as well as performance and reliability vs lifecycle cost.
- Handson in the manufacturing of electronics for high reliability military and government systems is preferred.
- Knowledge with root cause and corrective action analysis tools manufacturing process problems workmanship defects mechanical test failures etc.
- Excellence with solving problems as they occur recommending and implementing improvements as needed related to production processes.
- Ability to manage resources and multiple priorities while interacting with individuals at all levels within the organization and customers as required.
- Proficiency in Microsoft Excel Power Point and Word
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Employment Type
Full Time
