Staff Integrated Circuit IC Packaging Engineer
Staff Integrated Circuit IC Packaging Engineer
Posted on :
12-03-2025
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Monthly Salary
Not Disclosed
Salary Not Disclosed
Posted on :
12-03-2025
Job Description
STAFF INTEGRATED CIRCUIT PACKAGING ENGINEER
JOB SUMMARY
As a Staff Integrated Circuit (IC) Packaging Engineer you will have the manufacturing responsibility for our portfolio of RFIC devices and multichip modules (MCMs). This role requires a highly experienced IC assembly expert who has successfully deployed microelectronics and IC assembly solutions with a focus on plastic over molded and cavity package assemblies in a high mix low volume environment. This is a key role in the Engineering team which is suitable for someone who is handson collaborative results oriented and with a proven track record of technical leadership.
This role reports directly to the Director of Engineering.
ESSENTIAL DUTIES AND RESPONSIBILITIES
- Lead and own the design setup qualification and release to production of lowvolume inhouse assembly required for RFIC chip scale packaging of our MMIC devices multichip modules and air cavity QFNs.
- Select the appropriate equipment sets tooling and consumables. Conduct technical assessments drive equipment selection and buy off activities of all assembly equipment and proactively determine if existing assembly equipment can be used.
- Work with internal stakeholders to establish appropriate equipment buyoff criteria qualification plans and production release criteria.
- Develop endtoend package assembly processes required for RFIC chip scale packaging of our MMIC devices multichip modules and air cavity QFNs. Document processes and train equipment technicians and manufacturing teams.
- Develop and release to production robust assembly processes that support highest yield lowest cost and best efficiency through the lifecycle of the product.
- Optimize machine and process efficiency; equipment maintenance and repair; equipment programming and optimization; lot setup calibration and troubleshooting issues.
- Design lead frames and packages that are compatible with automated equipment and processes.
- Continually improve manufacturing methods utilizing knowledge of product design and materials fabrication processes automated equipment and quality standards.
- Provide technical leadership in solving production quality issues for MCMs and IC packaging.
- Perform root cause analysis and resolution of issues during both the development and production phases.
- Partner with design quality and reliability engineering teams to determine appropriate qualification testing strategies that ensure highest reliability of our product families in their end applications.
- Build on established engineering practices that support lean manufacturing techniques.
- Mentor junior engineers and lead technical development efforts across packaging and assembly disciplines.
- Promote an ethicsbased business culture in the organization.
REQUIREMENTS
- BS or MS in Mechanical Engineering Electrical Engineering Materials Engineering or other applied engineering disciplines.
- 10 years of professional experience in microelectronics assembly and packaging with a focus on IC plastic over mold packages.
- Successfully deployed automation previously for Chip Scale Packages Air Cavity QFNs and MCMs.
- Experience with RF components is a strong plus.
TECHNICAL COMPETENCIES
- Indepth handson experience with automated assembly equipment and processes for RFIC packaging including die attach wire bonding plastic over molding deflash singulation dicing saws laser engraving underfill epoxy dispense epoxy die attach solder die attach and flip chip.
- Experienced in production automation methodologies.
- Familiarity with package laminates.
- Designing tooling/fixturing for IC package assembly automation.
- Demonstrated ability to work independently and be flexible to changing priorities provide technical leadership and mentor younger engineers.
- Design of Experiments (DOE) & statistical process control experience required.
- Excellent data analysis skills and a logical approach to problem solving.
- Continuous improvement mindset within the organization.
- Strong oral and written communication skills. Able to effectively present information and respond to questions from management peers and customers.
- Highly proficient in a Windows environment and with a recent version of MS Office including Word Excel PowerPoint Outlook.
- 2D or 3D CAD experience using Solidworks is a plus.
- Outstanding work ethic and commitment to organizational success.
- This role requires the candidate to be 100 onsite.
CORE COMPETENCIES
- Business Acumen: Awareness and knowledge of and insight into the organization's vision structure culture philosophy operating principles values and code of ethics; ability to apply this understanding appropriately to diverse situations. Knowledge insight and understanding of business concepts tools and processes that are needed for making sound decisions in the context of the company's business; ability to apply this knowledge appropriately to diverse situations.
- Change: Knowledge of and ability to align the organization's people and culture with changes in business strategy organizational structure technology and business processes.
- Communication: Successful communication involves five components. Verbal communication refers to your ability to speak clearly and concisely. Nonverbal communication includes the capacity to project positive body language and facial expressions. Written communication refers to your skillfulness in composing text messages reports and other types of documents. Visual communication involves your ability to relay information using pictures and other visual aids. Active listening should also be considered a key communication skill because it helps you listen to and hear what others say. You need to be able to listen to understand how to best communicate with someone.
- Strategic Thinking: Understands business issues and opportunities and translates or aligns them to a vision strategy and plans to chart a course of action.
- Teamwork: Collaborate with others to achieve common goals. Build strong positive working relationships with supervisor and team members/coworkers. Exercise the ability to compromise and be adaptable.
- ProblemSolving / Critical Thinking: Ability to balance the needs of different people in a solution to a problem. Able to meet the needs of different constituents in the solution of a problem. Able to solve problems with multiple criteria that need to be met. Identifies and assesses all potential responses to a problem.
- Integrity / Work Ethic: Deal with Conflict Properly. Report Unethical Behavior. Be upfront about your short comings. Be willing to do hard work. Take accountability for your actions. Be a team player. Respect others. Don't abuse your power. Keep morale up.
- Interpersonal Skills: Interpersonal competencies help you interact communicate and collaborate with others effectively. Typical examples of interpersonal skills include empathy active listening and emotional intelligence.
Employment Type
Full Time
Key Skills
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