Surface Mount Technology Jobs in Japan
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Semiconductor Assembly Process Development Enginne...
Renesas Electronics
Yonezawa - Japan
募集背景当社では次世代パッケージ技術Flip ChipSiP などの開発を中心に半導体後工程における技術革新を積極的に推進しています特に AI高性能コンピューティングHPC車載IoT 分野においてはより高密度高信頼性高放熱性を備えたパッケージ技術が求められておりFCCSPFlip Chip Chip Scale Packageや FCBGA といった先端技術の...
21 days ago
Full Time
