Sr. Product Package Solution Engineer

• Be the product package solution project leader from Package Innovation R&D team to develop the package solution for Mobile Secure Communications Wireless Connectivity Power IoT and Radar applications.
• This position is responsible for leading the packaging projects for New Product Introduction and New Technology Introduction.
• Executing the projects to ensure that all the packaging deliverables are met to support a New product introduction and time to market.
• You will coordinate activities across multiple organizations including marketing IC design applications test assembly engineering internal and external manufacturing and you will be working with teams across multiple countries.
• Effectively coordinate and lead complex technical discussion across multiple organizations and stakeholders in NXP internal and external.
• Translating the product requirements for New product introduction in terms of package specific spec. reliability cost.

Qualifications :

• Masters or bachelors degree in Material Science Electrical Engineering.
• Proactive working attitude and capable to handle new challenge.
• Analytically strong drives for results able to deal with ambiguities.
• Ambitious energetic result-oriented entrepreneur with a strong drive for results.
• People person and team player very strong interpersonal skills
• Related field along with at least 10 years of experience in semiconductor IC packaging.
• Proficient risk assessment risk mitigation and 8D skill.
• Knowledge of related package platforms such as leadframe based laminate substrate flip chip and Wafer Level Chip Scale Packaging is also expected.
• Project management experience is required.
• Fluent verbal and writing in both English and Japanese skills are required for communication with US/European teams and Japanese Customers/Suppliers.

Preferred Qualifications :

• Understanding of foundry process assembly process and failure analysis.
• PMP and Six Sigma certification is preferred.
• Good coomunication in both English and Japanese languages.

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