Team Lead Co-Packaged Optics (mfd)
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Job Summary
Your mission
is building photonic processing systems that compute with light delivering a scalable energy-efficient alternative to transistor-based architectures for next-generation AI and HPC applications.
As ourTeam Lead Co-Packaged Optics you are the architectural and leadership anchor of our next-generation semiconductor packaging. You will build coach and scale a brand-new CPO Packaging Team from the ground up driving the transition from concept phase to high-volume production. This role is about establishing absolute technical ownership at the intersection of photonics and electronics bridging the gap between internal cutting-edge chip design and external global OSAT manufacturing.
Your Responsibilities
- Leadership& TeamArchitecture:Build mentoranddisciplinarilyleada high-performingCPOPackagingengineeringteam;executegapanalysesandstrategichiringtoaccelerateourscalingroadmap.
- OSAT & Supply Chain Mastery: Own the evaluation qualification and end-to-end technical management of global OSAT partners ensuring the secure onboarding of at least two qualified CPO suppliers within 12 months.
- Technical Ownership (CPO & Fiber Attach): Drive the development of advanced co-packaged photonic/electronic assemblies mastering deep hardware challenges across optical fiber coupling (Edge Coupling FAUs) advanced packaging materials and high-performance thermal management.
- Design for Excellence (DFM): Bridge the gap between engineering and mass manufacturing by implementing strict Design for Manufacturability (DFM) guidelines and ensuring reliability qualification under JEDEC and Telcordia standards.
- Cross-Functional Synergy: Act as the critical interface between internal Chip Design Systems Manufacturing Test and external supply chain stakeholders to ensure a seamless product introduction (NPI) and volume production roll-out.
- Continuous Engineering Quality: Champion rigorous root-cause analysis utilizing structured frameworks (8D FMEA Ishikawa) to rapidly resolve unexpected reliability or process deviations.
Your profile
- Academic Foundation: You hold a Bachelors or Masters degree in Electrical Engineering Materials Science Physics or a closely related technical field.
- Semiconductor & OSAT Expertise:You possess at least 5 years of profound experience within the Semiconductor Packaging industry (Back-End / OSAT environment) with a proven track record in global supplier evaluation.
- CPO & Precision Hands-on Skills:You have direct hands-on experience with Co-Packaged Optics (CPO) packaging optical fiber attachment methods and navigating advanced packaging materials (substrates underfills TIMs).
- Leadership & Empowerment:You have demonstrated experience in building scaling and coaching engineering teams fostering a culture of high performance and technical accountability.
- Analytical Self-Leadership: You thrive in high-growth innovative environments demonstrating an advanced solution-oriented mindset and strong process ownership under tight project milestones.
- Communication Excellence:You possess exceptional written and verbal communication skills; fluency in English is required. Prior experience with glass substrates and proficiency in German are considered a distinct advantage for collaborating with local stakeholders.
Why us
We hire for attitudeand train for skills.
We encourage self-responsibilityand accelerate professional development.
We move fastand encourage experimentation.
You have the opportunityto be part of developing breakthrough photonic computing technology and have a lasting impact on the future of computing.
You can be part ofa passionate international highly skilled cross-functional team.
You will have accessto the founders of the company.
About us
Who we are and what we do
is a deep-tech scale-up developing photonic processing solutions that compute natively with light and deliver a scalable alternative to transistor-based systems. The analog co-processors are optimised for complex computations and enable energy-efficient performance for next-generation AI and HPC collaboration with the Institute for Microelectronics Stuttgart IMS CHIPS operates its own pilot line for photonic chips based on the material system Thin-Film Lithium Niobate TFLN. was founded by Michael Förtsch in 2018 and is headquartered in Stuttgart Germany.About Company
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