Responsibilities:
• Drive adoption of Xpedition IC packaging products family by executing both pre-sale and post-sale technical activities.
• Understand the potential customers’ needs to either provide direct solutions or formalize the needs as potential enhancements/defects and feed them back to the engineering teams.
• Develop and deliver demonstrations and technical presentations.
• Drive software evaluations and benchmarks by prototyping and documenting Xpedition IC packaging flows using customer data.
• Help provide customer support (on site and off site) to the already-existing customers’ base.
• Contribute to technical sales plans and communicate with the account teams on progress and account status.
• Work with the account technology managers to understand business opportunities and be the technical go to person regarding these opportunities.
• Help provide feedback to the engineering teams regarding the newly introduced features.
• The Application Engineer is also expected to interface with other Siemens EDA products (Calibre, Aprisa, Tessent,. ) to help build a full advanced packaging design and verification flow.