IC Packaging Engineer
Share
Job Location:
Taipei City - Taiwan
Monthly Salary:
Not Disclosed
Posted on:
9 days ago
Vacancies:
1 Vacancy
Job Summary
- M.S or Ph.D. degree in mechanical engineering physics materials science or similar disciplines with a minimum of 5 years of experience in IC packaging.
- In-depth knowledge in uLED & CMOS sensing package integration good understanding to module process such as backside TSV Cu RDL glass bonding and dicing.
- Good understanding to Chip on Wafer Wafer on Wafer and Chiplet integration technologies.
- Knowledge in Silicon photonics and its application is a plus.
- Good understanding to advanced silicon node BEOL and device physics or component/board level reliability testing.
- Proven track record to drive issue resolution with good understanding to root cause and physics motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
- Good written and verbal communication skills. Able to present ideas design concepts data and plan with high confidence at internal or external meetings.
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
Ask Siri to name the most successful company in the world and it might respond: Apple. And it's not just out of familial pride. Apple consistently ranks highly in profit, revenue, market capitalization, and consumer cachet. In 2018, the company became the first reach a trillion dollar ... View more
