Senior Packaging Engineer

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profile Job Location:

Austin, TX - USA

profile Monthly Salary: $ 102550 - 190450
Posted on: 30+ days ago
Vacancies: 1 Vacancy

Job Summary

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the worlds most highly integrated SoCs Silicon Labs provides device makers the solutions support and ecosystems needed to create advanced edge connectivity applications. Headquartered in Austin Texas Silicon Labs has operations in over 16 countries and is the trusted partner for innovative solutions in the smart home industrial IoT and smart cities markets. Learn more at.

Meet the Team

The Assembly and Packaging team at Silicon Labs partners with suppliers and product teams to ensure successful new product introductions and innovative packaging solutions. We collaborate closely with cross-functional teams to design and validate packaging approaches that balance performance reliability and manufacturability. Our mission is to deliver high-quality cost-effective solutions that support our clients diverse applications in the semiconductor space.

Responsibilities

  • Lead new product introduction (NPI)efforts across multiple product lines driving supplier readinessqualification andramp toproduction for complex packaging technologies.

  • Define and implement advanced packaging strategiesin collaboration with design test and reliability teams tooptimizeelectrical thermal and mechanical performance.

  • Serve as a technical authorityfor package design and materialselection guiding cross-functional teams through trade-offs between cost performance and manufacturability.

  • Mentor and guide junior engineersin packaging design simulation and process development fostering a culture of technical excellence and continuous improvement.

  • Own supplier engagement and performance ensuring alignment with Silicon Labs roadmap quality expectations and technology readiness plans.

  • Conduct in-depth analysesusing simulation modeling and data-driven validation to predict and verify packaging reliability including thermal-mechanical stress warpage and material interactions.

  • Champion continuous improvement initiativesacross assembly packaging and supply chain operationsleveragingdata analytics and design-for-manufacturability principles.

  • Drive qualification and risk mitigation activitiesfor new materials processes and assembly technologies to enable next-generation packaging platforms.

Skills You Need

Minimum Qualifications

  • Bachelors orMasters degree in Mechanical Engineering Materials Science Industrial Engineering ora relatedfield (Ph.D. preferred).

  • 8 yearsof experience in semiconductor packaging assembly process development or related fields.

  • Provenexpertiseinadvanced packaging design(e.g. QFNSiP WLCSP flip chip or multi-die integration).

  • Strong understanding ofmaterials behavior thermal/mechanical stress andreliabilityphysics.

  • Proficiencywithsimulation and design toolssuch as ANSYS AutoCAD or equivalent.

  • Demonstrated ability toinfluence cross-functional teamsand manage external suppliers or partners.

  • Excellent analytical communication and leadership skills witha track recordof solving complex packaging challenges.

Preferred Qualifications

  • Hands-on experience withEDA toolssuch as Cadence or equivalent for package layout and co-design.

  • Knowledge ofreliability testing methodologies JEDEC standards and FMEA-based qualification approaches.

  • Experience drivingtechnology developmentwith OSAT partners or R&D teams.

  • Familiarity withAI/ML-driven modelingor digital twin techniques for packaging performance prediction.

  • Proven success leadingcross-site cross-functional projectsfrom concept through high-volume production.

Benefits & Perks

You can look forward to the following benefits:

  • Great medical (Choice of PPO or Consumer Driven Health Plan with HSA) dental and vision plans

  • Highly competitive salary

  • 401k plan with match and Roth plan option

  • Equity rewards (RSUs)

  • Employee Stock Purchase Plan (ESPP)

  • Life/AD&D and disability coverage

  • Flexible spending accounts

  • Adoption assistance

  • Back-Up childcare

  • Additional benefit options (Commuter benefits Legal benefits Pet insurance)

  • Flexible PTO schedule

  • 3 paid volunteer days per year

  • Charitable contribution match

  • Tuition reimbursement

  • Free downtown parking

  • Onsite gym

  • Monthly wellness offerings

  • Free snacks

  • Monthly company updates with our CEO

The annualized base pay range for this role is expected to be between $102550 - $190450 USD. Actual base pay could vary based on factors including but not limited to experience geographic location where work will be performed and applicants skill set. The base pay is just one component of the total compensation package for employees. Other rewards may include an annual cash bonus equity package and a comprehensive benefits package.

Silicon Labs is an equal opportunity employer and values the diversity of our employees. Employment decisions are made on the basis of qualifications and job-related criteria without regard to race religion color national origin gender sexual orientation age marital status veteran status or disability status or any other characteristic protected by applicable law.


Required Experience:

Senior IC

Silicon Labs (NASDAQ: SLAB) is the leading innovator in low-power wireless connectivity building embedded technology that connects devices and improves lives. Merging cutting-edge technology into the worlds most highly integrated SoCs Silicon Labs provides device makers the solutions support and eco...
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Key Skills

  • Continuous Integration
  • Food Industry
  • Minitab
  • Packaging
  • CAD
  • Mechanical Knowledge
  • Plastics Blow Molding
  • SolidWorks
  • Mechanical Engineering
  • Plastics Injection Molding
  • Microsoft Project
  • Manufacturing

About Company

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Silicon Labs makes silicon, software and solutions for a more connected world.

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