Internships in EquipmentProcess Engineering Summer 2026

Austin - USA

Monthly Salary: Not Disclosed

Posted on: 30+ days ago

Vacancies: 1 Vacancy

Job Summary

Our Operations & Manufacturing Groups play an essential role in the companys success by ensuring the delivery of high quality scalable cost-competitive technologies and supply to create a competitive advantage for our customers. Our manufacturing plants or wafer fabs are run by Equipment Process and Manufacturing Engineers who use their experience and skills to make sure the products we turn out are the best in the industry.

Engineers might work with Photo Etch or Implant Machinery

Depending on the role Scope of Responsibilities/Expectations may include:

Responsible for monitoring and controlling wafer fabrication processes and equipment
Implementation of Six-Sigma statistical process control methods
Prevent and reduce wafer scrap and defectivity
Improve equipment reliability and availability
Participate in cross-functional and Lean activity teams
Define manufacturing procedures
Develop and write process specifications
Determine root cause of defect issues and drive resolution.
Partner with other engineers to reduce tool-level defect levels (both excursion reduction and baseline improvement)
Sample submissions process and validation of all required documentation
Develop tools to improve processes (ie. ADEPT Databases Tracking Quartz)
Organize implement and optimize production process flow
Develop working instructions and process documents
Sustain and improveprocesses to meet manufacturing demand for throughput and cycle time
Improve quality levels by driving to root cause to eliminate scrap and yield loss mechanisms
Identify and execute cost reduction solutions to meet Factory budget goals
Collaborate across teams to improve overall process performance
Reduce defectivity mechanisms and improve process control
Work with minimal supervision balancing competing priorities to serve the needs of the engineering and manufacturing communities
Work collaboratively with process and product engineers to enhance the quality and reliability performance of NXP products.
Utilize data analytics to help identify customer return common causes and evaluate the effectiveness of corrective actions across a wide range of products and technologies.
Serve as a focal point in the organization for structured problem solving and as a liaison between the manufacturing and product organizations.
Establish monitor and develop improvement plans for quality key performance indicators.
Define and validate package designs materials and processes used for development of new products for NXP.
Develop DOEs and tests to evaluate suitability and reliability of package solutions.
Work with the Business Lines and the factories (both internal to NXP and subcons) to qualify the package/product solutions.
Manage the package process using industry standard project management tools.
Develop solutions by working closely with Package Innovation teams (Design Materials Modeling (electrical/thermal/mechanical) and Package Processing).
Address and solve materials and processing issues that may occur during the development process.

Job Qualifications:

Currently pursuing BS orMSin Materials Science Mechanical Engineering Chemical Engineering Electrical Engineering Physics or similar is required

Experience or coursework in the following are helpful in determining where youd best fit in:

Knowledge of statistical process control
Knowledge of Lean principles and Lean Manufacturing techniques
Theoretical and/or practical knowledge of semiconductor fabrication processes
Experience in Lean Manufacturing a plus
Ability to deal with multiple issues and shifting priorities
Strong verbal and written communication skills
Ability to interact with multiple disciplines in a 7x24 manufacturing facility
Strong verbal and written communication skills
Good Teamwork and a desire to work with people to create a positive work environment
Excellent Troubleshooting skills
Use of Oscilloscope and reading and understanding waveforms
Knowledge of quality improvement methods including FMEA 8D and 3x5 Why is required.
Demonstrated skill in handling of customer complaints from failure analysis to execution of root cause corrective action and implementation of best practices is a must.
Candidate must have excellent interpersonal and communication skills and be experienced with Microsoft Office and statistical data analysis tools such as JMP or Stata.
Working knowledge of Tableau and SQL is desired
Six-sigma Black Belt training highly desired
Team player with positive attitude self-driven with excellent communication and presentation skills (both written and verbal) are required.
Working knowledge of various IC packages like QFP QFN BGA flip chip wafer level fan-in and fan-out is a plus.
Knowledge of Statistical Analysis and Design of Experiment is a plus.
Ability to work in a dynamic fast-paced environment flexible and capable of adapting to changes while collaborating with teams at engineering and management levels both globally and locally.

Primary locations:

Austin TX or Chandler AZ

This posting is not presently tied to a specific opening however by submitting your application youll be considered for any current or future opportunities in Equipment/Process Engineering that align with your background interests and qualifications.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age color national origin race religion creed gender sex sexual orientation gender identity and/or expression marital status status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal state or local addition NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-e41b

Required Experience:

Intern

Engineers might work with Photo Etch or Implant Machinery

Depending on the role Scope of Responsibilities/Expectations may include:

Responsible for monitoring and controlling wafer fabrication processes and equipment
Implementation of Six-Sigma statistical process control methods
Prevent and reduce wafer scrap and defectivity
Improve equipment reliability and availability
Participate in cross-functional and Lean activity teams
Define manufacturing procedures
Develop and write process specifications
Determine root cause of defect issues and drive resolution.
Partner with other engineers to reduce tool-level defect levels (both excursion reduction and baseline improvement)
Sample submissions process and validation of all required documentation
Develop tools to improve processes (ie. ADEPT Databases Tracking Quartz)
Organize implement and optimize production process flow
Develop working instructions and process documents
Sustain and improveprocesses to meet manufacturing demand for throughput and cycle time
Improve quality levels by driving to root cause to eliminate scrap and yield loss mechanisms
Identify and execute cost reduction solutions to meet Factory budget goals
Collaborate across teams to improve overall process performance
Reduce defectivity mechanisms and improve process control
Work with minimal supervision balancing competing priorities to serve the needs of the engineering and manufacturing communities
Work collaboratively with process and product engineers to enhance the quality and reliability performance of NXP products.
Utilize data analytics to help identify customer return common causes and evaluate the effectiveness of corrective actions across a wide range of products and technologies.
Serve as a focal point in the organization for structured problem solving and as a liaison between the manufacturing and product organizations.
Establish monitor and develop improvement plans for quality key performance indicators.
Define and validate package designs materials and processes used for development of new products for NXP.
Develop DOEs and tests to evaluate suitability and reliability of package solutions.
Work with the Business Lines and the factories (both internal to NXP and subcons) to qualify the package/product solutions.
Manage the package process using industry standard project management tools.
Develop solutions by working closely with Package Innovation teams (Design Materials Modeling (electrical/thermal/mechanical) and Package Processing).
Address and solve materials and processing issues that may occur during the development process.

Job Qualifications:

Currently pursuing BS orMSin Materials Science Mechanical Engineering Chemical Engineering Electrical Engineering Physics or similar is required

Experience or coursework in the following are helpful in determining where youd best fit in:

Knowledge of statistical process control
Knowledge of Lean principles and Lean Manufacturing techniques
Theoretical and/or practical knowledge of semiconductor fabrication processes
Experience in Lean Manufacturing a plus
Ability to deal with multiple issues and shifting priorities
Strong verbal and written communication skills
Ability to interact with multiple disciplines in a 7x24 manufacturing facility
Strong verbal and written communication skills
Good Teamwork and a desire to work with people to create a positive work environment
Excellent Troubleshooting skills
Use of Oscilloscope and reading and understanding waveforms
Knowledge of quality improvement methods including FMEA 8D and 3x5 Why is required.
Demonstrated skill in handling of customer complaints from failure analysis to execution of root cause corrective action and implementation of best practices is a must.
Candidate must have excellent interpersonal and communication skills and be experienced with Microsoft Office and statistical data analysis tools such as JMP or Stata.
Working knowledge of Tableau and SQL is desired
Six-sigma Black Belt training highly desired
Team player with positive attitude self-driven with excellent communication and presentation skills (both written and verbal) are required.
Working knowledge of various IC packages like QFP QFN BGA flip chip wafer level fan-in and fan-out is a plus.
Knowledge of Statistical Analysis and Design of Experiment is a plus.
Ability to work in a dynamic fast-paced environment flexible and capable of adapting to changes while collaborating with teams at engineering and management levels both globally and locally.